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RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-058.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO4730G3 20mil
Layer count: 2 layers
PCB thickness: 0.6mm
PCB size: 110mm x 50mm = 1 type = 1 piece
Solder mask: Green
Silkscreen: White
Copper weight: Outer layer 35 μm
Surface finish: Immersion gold
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RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask


Rogers High Frequency PCB Built On RO4730G3 20mil 0.508mm DK3.0 With Immersion Gold for Cellular Base Station Antenna

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.


RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.


Typical application is cellular base station antennas.


General description

This is a type of double sided RF PCB built on 0.508mm (20mil) RO4730G3 for the application of Cellular Base Station Antenna PCB.


Basic specifications

Base material: RO4730G3 20mil (0.508mm)

Dielectric constant: 3.0+/-0.5

Layer count: 2 layers

Type: Through holes

Format: 110mm x 50mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 0.60 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months



Data Sheet of Rogers 4730 (RO4730G3)

RO4730G3 Typical Value
PropertyRO4730G3DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.5Z10 GHz 23℃IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign2.98Z1.7 GHz to 5 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0028Z10 GHz 23℃IPC-TM-650 2.5.5.5
2.5 GHz
Thermal Coefficient of ε+34Zppm/℃-50 ℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability<0.4X, Ymm/mafter etech +E2/150 ℃IPC-TM-650 2.4.39A
Volume Resistivity (0.030")9 X 107MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity (0.030")7.2 X 105COND AIPC-TM-650 2.5.17.1
PIM-165dBc50 ohm 0.060"43 dBm 1900 MHz
Electrical Strength (0.030")730ZV/milIPC-TM-650 2.5.6.2
Flexural Strength MD181 (26.3)Mpa (kpsi)RTASTM D790
CMD139 (20.2)
Moisure Absorption0.093-%48/50IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity0.45ZW/mK50℃ASTM D5470
Coefficient of Thermal Expansion15.9
14.4
35.2
X
Y
Z
ppm/℃-50 ℃to 288℃IPC-TM-650 2.4.4.1
Tg>280IPC-TM-650 2.4.24
Td411ASTM D3850
Density1.58gm/cm3ASTM D792
Copper Peel Stength4.1pli1oz,LoPro EDCIPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes

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