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Customized Double Sided RF PCB 32mil Rogers 0.813mm RO4003C

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-006.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO4300C
PCB thickness: 0.9mm
PCB size: 98 x 72mm=1PCS
Layer count: 2 layers
Copper weight: 35um
Surface finish: ENIG
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Customized Double Sided RF PCB 32mil Rogers 0.813mm RO4003C


Rogers 4003 32mil 0.813mm PCB RO4003C Double Sided RF High Frequency PCB for Filters

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RO4003C hydrocarbon ceramic laminates are designed to deliver exceptional high-frequency performance while keeping circuit construction costs low. As operating frequencies exceed 500 MHz, the laminates available for designers become limited, but RO4003C remains a reliable choice for RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss makes it a preferred material for applications where standard circuit board materials cannot be used at higher operating frequencies. Additionally, RO4003C has a consistent dielectric constant across a wide frequency range and one of the lowest temperature coefficients of any circuit board material. Its thermal coefficient of expansion (CTE) offers several advantages to PCB designers, including high dimensional stability, which is critical for creating mixed dielectric multi-layer boards. Even under extreme thermal shock conditions, RO4003C's low Z-axis CTE ensures dependable plated through-hole quality. Furthermore, the material's expansion characteristics remain stable across the entire temperature range of PCB processing, thanks to its Tg of >280C.


PCB Specifications

PCB SIZE98 x 72mm=1PCS
BOARD TYPE
Number of LayersDouble sided PCB
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 35um(1oz)+PLATE
RO4003C 32 mil 0.813mm
copper ------- 35um(1oz)+PLATE
TECHNOLOGY
Minimum Trace and Space:6.98mil/6.28mil
Minimum / Maximum Holes:0.3/1.2mm
Number of Different Holes:5
Number of Drill Holes:481
Number of Milled Slots:0
Number of Internal Cutouts:1
Impedance Controlno
BOARD MATERIAL
Glass Epoxy:RO4003C 32 mil (0.813mm), Tg 288
Final foil external:1.5oz
Final foil internal:0oz
Final height of PCB:0.9 mm ±0.1
PLATING AND COATING
Surface FinishImmersion Gold
Solder Mask Apply To:NO
Solder Mask Color:NO
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendNO
Colour of Component LegendNO
Manufacturer Name or Logo:N/A
VIAPlated Through Hole(PTH)
FLAMIBILITY RATINGN/A
DIMENSION TOLERANCE
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

RO4003C PCBs (Printed Circuit Boards) play a critical role in various electronic applications, including automotive radar and sensors, cellular base station antennas, direct broadcast satellites, low noise block, power amplifiers, and RFID.



Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
PropertyRO4003CDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.38±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0027
0.0021
Z10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength139(20.2)
100(14.5)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength276
(40)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m
(mil/inch)
after etch+E2/150IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion11
14
46
X
Y
Z
ppm/-55to288IPC-TM-650 2.4.41
Tg>280 TMAAIPC-TM-650 2.4.24.3
Td425 TGAASTM D 3850
Thermal Conductivity0.71W/M/oK80ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density1.79gm/cm323ASTM D 792
Copper Peel Stength1.05
(6.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityN/AUL 94
Lead-free Process CompatibleYes

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