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Rogers 4003 12mil Double Sided RF High Frequency PCB Immersion Gold

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-008.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers 4300C
PCB size: 67 x 67mm=1up
PCB thickness: 0.4mm
Copper weight: 1oz
Layer count: 2 Layers
Surface finish: immersion gold
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Rogers 4003 12mil Double Sided RF High Frequency PCB Immersion Gold


Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO4003C PCBs are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required, so RO4003C PCBs can provide us with competitive price and high volume applications in cellular base station antennas, power amplifiers, RF identification tags, automotive radar and sensors etc.


The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.


PCB Specifications

PCB SIZE67 x 67mm=1up
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
RO4003C 0.305mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:7.9 mil / 5.9 mil
Minimum / Maximum Holes:0.4 mm / 0.4 mm
Number of Different Holes:1
Number of Drill Holes:3
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:RO4003C Tg280℃, er<3.48, Rogers Corp.
Final foil external:1.5 oz
Final foil internal:N/A
Final height of PCB:0.4 mm ±0.1
PLATING AND COATING
Surface FinishImmersion gold, 18%
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAPlated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATINGN/A
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.


Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID


Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
PropertyRO4003CDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.38±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0027
0.0021
Z10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength139(20.2)
100(14.5)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength276
(40)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m
(mil/inch)
after etch+E2/150IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion11
14
46
X
Y
Z
ppm/-55to288IPC-TM-650 2.4.41
Tg>280 TMAAIPC-TM-650 2.4.24.3
Td425 TGAASTM D 3850
Thermal Conductivity0.71W/M/oK80ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density1.79gm/cm323ASTM D 792
Copper Peel Stength1.05
(6.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityN/AUL 94
Lead-free Process CompatibleYes

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