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Rogers 4350 High frequency PCB 1.524mm Double Sided RF Circuit Board

Categories Rogers PCB Board
Brand Name: bicheng
Model Number: BIC-001-V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1 pcs
Price: USD 9.99-99.99 per piece
Payment Terms: T/T
Supply Ability: 50000 pcs per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+ Cartons
Base material:: RO4350B
Thickness: 1.6mm
Copper weight:: 1oz
Surface finish:: immersion gold
Layer count:: 2 layers
PCB size:: 135 x 135mm
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Rogers 4350 High frequency PCB 1.524mm Double Sided RF Circuit Board


High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO4350B hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above.


The qualities required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines are present in the material RO4350B. Since standard circuit board materials cannot be used in many applications due to higher operating frequencies, low dielectric loss makes it possible to employ RO4350B material in these applications.


The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material.


The thermal coefficient of expansion (CTE) of RO4350B material offers PCB designers a number of significant advantages. Due to its identical expansion coefficient to that of copper, RO4350B exhibits high dimensional stability, a quality required for the fabrication of mixed dielectric multi-layer boards.


The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.


RO4350B PCB Specifications

PCB SIZE135 x 135mm=1PCS
BOARD TYPEHigh frequency PCB, RF PCB
Number of LayersDouble sided PCB
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 35um(1oz)+PLATE
RO4350B 60mil
copper ------- 35um(1oz)+PLATE
TECHNOLOGY
Minimum Trace and Space:11mil/12mil
Minimum / Maximum Holes:0.3/2.2mm
Number of Different Holes:5
Number of Drill Holes:184
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance ControlNO
BOARD MATERIAL
Glass Epoxy:RO4350B 60mil, Tg 288℃
Final foil external:1.5oz
Final foil internal:0oz
Final height of PCB:1.6mm ±0.16
PLATING AND COATING
Surface FinishElectroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel)
Solder Mask Apply To:NO
Solder Mask Color:NO
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendNO
Colour of Component LegendNO
Manufacturer Name or Logo:N/A
VIAPlated Through Hole(PTH)
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

The typical applications included automotive radar and sensors, cellular base station antennas, direct broadcast satellites, low noise block, power amplifiers, RFID.



Data sheet of Rogers 4350B (RO4350B )

RO4350B Typical Value
PropertyRO4350BDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037
0.0031
Z10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength203(29.5)
130(18.9)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength255
(37)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mil/inch)
after etch+E2/150IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
32
X
Y
Z
ppm/-55to288IPC-TM-650 2.4.41
Tg>280 TMAAIPC-TM-650 2.4.24.3
Td390 TGAASTM D 3850
Thermal Conductivity0.69W/M/oK80ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density1.86gm/cm323ASTM D 792
Copper Peel Stength0.88
(5.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability(3)V-0UL 94
Lead-free Process CompatibleYes



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