Low Thermal Inpedance 9W/MK Silicone Thermal Conductive Gel For Vehicle Engine Control

Low Thermal Inpedance 9W/MK Silicone Thermal Congductive Gel For Vihicel Enginee Controler

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

TIF^®090-11 is a soft silicone-based gap filler pad formulated with thermally conductive fillers and a unique compound that combines excellent themal performance with outstanding softness. Compared to conventional thermal grease,TIF^®090-11 has a higher viscosity, effectively preventing the separation of fllers from the siliconebase. lt also offers more stable bond line control under pressure,enhancing product reliability. TIF^®090-11 is applied similaty to traditional themal paste and is compatible with various commercial equipment,such as dispensing systems or automated production equipment. lt is suitable for a wide range of high-power electronic components and packaging formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA, micro BGA,BGA,DSP chips, circular accelerator chips, and LED lighting modules.

Application
> Heat-sink & frame
> LED backlight module,LED lighting

> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler

> Telecom industry
> Semiconductor automatic laboratory equipment

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

Ziitek D-U-N-S® Number: 656191068