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| Categories | Thermal Conductive Gel |
|---|---|
| Brand Name: | ZIITEK |
| Model Number: | TIF015-07 |
| Certification: | UL and RoHs |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | negotiation |
| Supply Ability: | 10000/day |
| Delivery Time: | 7-15work days |
| Packaging Details: | 1000tubes |
| Products Name: | Factory Thermal Conductive Gel For Electronic Components Cooling |
| Specific Gravity: | 2.5 g/cc |
| Good thermal conductive: | 1.5 W/mK |
| Color: | Green |
| Continuous Use Temperature: | -45~200℃ |
| Flame Rating: | 94V0 |
| Keywords: | Thermal Conductive Gel |
| Material: | Ceramic filled silicon material |
| Company Info. |
| Dongguan Ziitek Electronic Materials & Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Factory Thermal Conductive Gel For Electronic Components Cooling
TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF015-07 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
TIF015-07-Specification-sheet.-pdf.pdf
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
Feature
> Thermal conductivity: 1.5W/mK
> Soft, very low compression
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
| TIFTM015-07 Property | ||
| Property | Value | Test method |
| Color | Green | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Viscosity | 4000 Pa.s | GB/T 10247 |
| Specific Gravity | 2.5g/cm³ | ASTM D297 |
| Thermal conductivity | 1.5 W/mK | ISO 22007-2 |
| Thermal diffusivity | 0.847 mm²/s | ISO 22007-2 |
| Specific heat capacity | 2.2 MJ/m3K | ISO 22007-2 |
| Continuous Use Temperature | -45 ~200°C | ****** |
| Flame Rating | 94V0 | UL E331100 |
Package :
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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