New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

TIF035-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF035-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF035-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-35 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

TIF035-05 Series Datasheet-REV02.pdf

Application

>Heat-sink & frame

>LED backlight module,LED lighting

>High speed hardware driver

>Micro heat pipe ,Vihicel enginee controler

>Telecom industry

Feature

>Thermal conductivity: 3.5W/mK

>Soft, very low compression

>Operate automaticly

Package :

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

Ziitek D-U-N-S® Number: 656191068