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| Categories | Thermal Conductive Gel |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIF070-11 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1000tube |
| Price: | 0.1-100USD/KG |
| Payment Terms: | T/T |
| Supply Ability: | 10000KG/MONTH |
| Delivery Time: | 3-8 WORK DAYS |
| Packaging Details: | 30cc/PCS |
| Products Name: | Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer |
| Application: | For CPU Heat Dissipation |
| SPecific Gravity: | 3.5g/cc |
| Color: | Gray |
| flame rating: | UL 94 V-0 |
| Certifications: | RoHS |
| Thermal conductivity: | 7.0 W/m-K |
| Keywords: | Thermal Conductive Silica Gel |
| Company Info. |
| Dongguan Ziitek Electronical Material and Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer
Products description
TIF®070-11 is a soft silicone gel-based gap filler pad, formulated with
a special blend of fillers to provide both excellent thermal
conductivity and superior softness. Compared to conventional
thermal greases, TIF®070-11 has a higher viscosity, which effectively prevents filler
separation from the silicone matrix and reduces filler migration,
helping maintain consistent thermal performance. It is applied in a
similar manner to thermal grease and is suitable for commercial
dispensing or automated equipment. Typical applications include
flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages,
DSP chips, circular silicon chips, LED lighting, and other
high-power electronic components.
Feature
> Thermal conductivity :7.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor 'automatic laboratory equipment.
| TIF®070-11 Typical Properties | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | - |
| Flow Rate(g/min) | 30 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
| Density(g/cc) | 3.50g/c | ASTM D297 |
| Thermal conductivity | 7.0W/mK | ASTM D5470 |
| Thermal Impedance @10psi (℃.in²w) | 0.142 | ASTM D5470 |
| Thermal Impedance @50psi (℃.in²w) | 0.12 | ASTM D5470 |
| Recommended Operating Temp | -45 ~200°C | Ziitek Test Method |
| Dielectric Strength(V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness(mm) | 0.2 | Ziitek Test Mothod |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
Custom packaging available for automation use. Please contact us
for confirming.
If you want to know our thermal products, please visit our website.
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal
conductive materials, owns advanced production equipment and optimized process, can provide
various thermal solutions for different applications.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it
is 7-10 work days if the goods are not in stock, it is according to
quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
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