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| Categories | Thermal Conductive Gel |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIF080 AB-11S |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1000 pcs |
| Price: | 0.1-10 USD/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 100000pcs/month |
| Delivery Time: | 3-8 work days |
| Packaging Details: | 25*13*12cm carton |
| Name: | High Thermal Conductive Two Component Thermal Gel For Computer And Peripherals |
| Thermal Conductivity: | 8.0W/mk |
| Hardness: | 45 Shore 00 |
| Color A/B: | White / Gray |
| Flame Rating: | 94V0 |
| Keyword: | Thermally Conductive Gel |
| Application: | Computer and peripherals |
| Suggested Temp Range: | -45~200℃ |
| Company Info. |
| Dongguan Ziitek Electronical Material and Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Ziitek TIF®080 AB-11S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.
Features
< Computer and peripherals
< Telecommunications
< Automotive electronics
< Thermally conductive vibrationdampening
< Heat sink and any heatgenerating semicondutor
| Typical Properties of TIF®080 AB-11S Series | |||
| Typical Uncured Material | |||
| Property | Numerical | Test Method | |
| Color/Part A | White | Visual | |
| Color/Part B | Gray | Visual | |
| Fiow Rate (g/min) @75psi | 4.5 | ****** | |
| Density | 3.4g/cm³ | ASTM D792 | |
| Bond line thickness(mm) | 0.2 | ASTM D374 | |
| Mix Ratio | 1:1 | ****** | |
| Shelf Life@25℃ | 6 months | ****** | |
| Cure Schedule | |||
| Pot Life @25℃ | 30 min | ****** | |
| Cure @25℃ | 120 min | ****** | |
| Cure @100℃ | 30 min | ****** | |
| Cure Properties | |||
| Color | Gray | Visual | |
| Hardness | 45 shore00 | ASTM D2240 | |
| Continuous Use Temp | -45~200℃ | ****** | |
| Voltage Strength | ≥4000 V/mm | ASTM D149 | |
| Volume Resistivity | ＞1.0*1012 Ohm-meter | ASTM D257 | |
| Flame Rating | V-0 | UL 94 | |
| Thermal Conductivity | 8.0W/mK | ASTM D5470 | |
| Thermal impedance@10psi (℃-in2/W) | 0.72 | ASTM D5470 | |
| Thermal impedance@50psi (℃-in2/W) | 0.60 | ASTM D5470 | |
Product packing details:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing
applications. Please contact us for confirming.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
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