Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission

Rogers 6-Layer RO3003 RF PCB bonding by Taconic FastRise-28 Prepreg for High Speed Signal Transmission

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:

1) Global positioning satellite antennas

2) Patch antenna for wireless communications

3) Power amplifiers and antennas

4) Power backplanes

5) Remote meter readers

Taconic company's FastRise-28 semi-solidified sheet is specially designed for high-speed digital signal transmission applications and millimeter-wave RF multi-layer printed board manufacturing. It is matched with other microwave substrate materials of TACONIC company to manufacture multilayer microwave printed circuit boards.

FastRise-28 semi-solidified sheet can meet the design requirements of stripline structure with low dielectric loss. The thermosetting properties of the adhesive material make it meet the design requirements of multiple laminated manufacturing. In addition, a large number of ceramic powder fillers are selected in the composition of the semi-solidified sheet, which makes the dimensional stability of the corresponding products very good. Because of its high performance thermosetting resin, it shows good bonding effect on copper foil and some PTFE materials.

The main properties of this adhesive sheet material are shown in the table below.

More FastRise Prepregs

Refrigeration

FastRise is a non-reinforced prepreg that is manufactured between release liners so that individual plies of FastRise do not stick together. The adhesive layer on the surface of the PTFE/cereamic film can be quite tacky especially for freshly manufactured material. It is recommended to refrigerate FastRise prior to lamination. Continuous refrigeration is always a good practice for storing prepregs as this will extend the shelf lile. However, because FastRise can be quite tacky, FastRise should be refrigerated as close to 4℃ as possible. FastRise will stiffen up and will separate from the release liners a lot easier.

Lamination

Various laminate cores are used in conjunction with FastRise prepreg to produce multilayer boards for the RF/digital/ATE multilayer markets. FastRise when used in a symmetrical board design, will result in optimum electrical and mechanical performance. Because of the thermoset properties of the bonding agent, multiple bonding cycles can be achieved without worry of delamination. In addition, the recommended press temperature of 215.5℃ is within reach of most boards houses.

Here’s a type of RF PCB built on Rogers RO3003 core bonding by FastRise-28. It is 6-layer stack-up with 1oz copper on each layer. Finished board will be 1.2mm thick, pads are immersion gold plated. There’s 2+N+2 steps blind via from layer 1 to layer 4. See the stack-up as follows.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners