| Sign In | Join Free | My frbiz.com |
|
| Sign In | Join Free | My frbiz.com |
|
| Categories | RF PCB Board |
|---|---|
| Brand Name: | Bicheng |
| Model Number: | BIC-026.V1.0 |
| Certification: | UL, ISO9001, IATF16949 |
| Place of Origin: | CHINA |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Payment Terms: | T/T |
| Supply Ability: | 5000PCS per month |
| Delivery Time: | 8-9 working days |
| Packaging Details: | Vacuum bags+Cartons |
| Base material: | RF-35TC |
| Layer count: | 2 layers |
| PCB size: | 90 x 45mm=1PCS |
| PCB thickness: | 0.8mm |
| Solder mask: | Green |
| Silkscreen: | White |
| Copper weight: | 1oz |
| Surface finish: | ENIG |
| Company Info. |
| Bicheng Electronics Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
Taconic High Frequency PCB Built on RF-35TC 30mil 0.762mm With Black Solder Mask for Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.
RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.
This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.
Antennas, satellites, filters, couplers, and power amplifiers find the RF-35TC laminates to be the perfect fit.
PCB Specifications
| PCB SIZE | 90 x 45mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1 oz)+plate TOP layer |
| RF-35TC 0.762mm | |
| copper ------- 35um(1oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 5 mil |
| Minimum / Maximum Holes: | 0.4 mm / 5.5 mm |
| Number of Different Holes: | 9 |
| Number of Drill Holes: | 21 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | 1 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RF-35TC 0.762mm |
| Final foil external: | 1.5 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.8 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | ENIG |
| Solder Mask Apply To: | TOP, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of RF-35TC
| RF-35TC TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.5.1(modified) | 3.5 | 3.5 | ||
| Tck(-30 to 120℃) | IPC-650 2.5.5.5.1(modified) | ppm | 24 | ppm | 24 |
| Df @10 GHz | IPC-650 2.5.5.5.1(modified) | 0.0011 | 0.0011 | ||
| Dielectric Breakdown | IPC-650 2.5.6(in-Plane,Two Pins in Oil) | kV | 56.7 | kV | 56.7 |
| Dielectric Strength | ASTM D 149(Through Plane) | V/mil | 570 | V/mm | 22,441 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 304 | Seconds | 304 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.05 | % | 0.05 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 12,900 | N/mm2 | 88.94 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 11,700 | N/mm2 | 80.67 |
| Tensile Strength(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 9,020 | N/mm2 | 62.19 |
| Tensile Strength(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 7,740 | N/mm2 | 53.37 |
| Elongation at Break(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.89 | N/mm | 1.89 |
| Elongation at Break(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.7 | % | 1.7 |
| Young's Modulus(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 667,000 | N/mm2 | 4,599 |
| Young's Modulus(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 637,000 | N/mm2 | 4,392 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.18 | 0.18 | ||
| Poisson's Ratio(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.23 | 0.18 | ||
| Compressive Modulus | ASTM D 695(23℃) | psi | 560,000 | N/mm2 | 3,861 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.46 x 106 | N/mm2 | 10,309 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.50 x 106 | N/mm2 | 10,076 |
| Peel Stength(½ oz.CVH) | IPC-650 2.4.8(Thermal Stress.) | Ibs./inch | 7 | g/cm3 | 1.25 |
| Thermal Conductivity(Unclad,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.6 | W/(mK) | 0.6 |
| Thermal Conductivity(C1/C1,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.92 | W/(mK) | 0.92 |
| Thermal Conductivity(CH/CH,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.87 | W/(mK) | 0.87 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.23 | mm/M | 0.23 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.64 | mm/M | 0.64 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | -0.04 | mm/M | -0.04 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.46 | mm/M | 0.46 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 8.33 x 107 | Mohms | 8.33 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 6.42 x 107 | Mohms | 6.42 x 107 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 5.19 x 108 | Mohms/cm | 5.19 x 108 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 2.91 x 108 | Mohms/cm | 2.91 x 108 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 11 | ppm/℃ | 11 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 13 | ppm/℃ | 13 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 34 | ppm/℃ | 34 |
| Density | ASTM D 792 | g/cm3 | 2.35 | g/cm3 | 2.35 |
| Hardness | ASTM D 2240(Shore D) | 79.1 | 79.1 | ||
| Strain at Break(MD) | ASTM D 790/IPC-650 2.4.4 | % | 0.014 | % | 0.014 |
| Strain at Break(CD) | ASTM D 790/IPC-650 2.4.4 | % | 0.013 | % | 0.013 |
| Specific Heat | ASTM E 1269-05,E 967-08,E968-02 | j/(g℃) | 0.94 | j/(g℃) | 0.94 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 788 | ℃ | 420 |
| Td(5% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 817 | ℃ | 436 |
|
TLY-3 lightweight 100x90mm Communication PCB 2 Sided Taconic TLY Laminates
Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB
RO3035 20mil 0.508mm DK3.5 RF PCB Board For Direct Broadcast Satellites
1.6mm TLF-35 RF PCB Board Ultra Low Moisture Absorption Rate
TLY-5 7.5mil 0.191mm Double Sided Printed Circuit Boards With DK2.2
RO3010 25mil 0.635mm Microwave PCB Board LPSM Solder Mask
Rogers 3035 60mil 1.524mm RF PCB Board For Remote Meter Readers
Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
20mil Double Sided 1oz RF PCB Board With RT/Duroid 5870 Base Material
60mil AD250C Double Sided Rigid Circuit Board With Hot Air Soldering Level
