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| Categories | RF PCB Board |
|---|---|
| Brand Name: | Bicheng |
| Model Number: | BIC-035.V1.0 |
| Certification: | UL, ISO9001, IATF16949 |
| Place of Origin: | CHINA |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Payment Terms: | T/T |
| Supply Ability: | 5000PCS per month |
| Delivery Time: | 8-9 working days |
| Packaging Details: | Vacuum bags+Cartons |
| Base material: | TLY-5 |
| Layer count: | 2 layers |
| PCB thickness: | 0.25mm |
| PCB size: | 76 x 51mm=1PCS |
| Silkscreen: | White |
| Copper weight: | 0.5oz |
| Surface finish: | OSP |
| Company Info. |
| Bicheng Electronics Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
Taconic High Frequency PCB Made on TLY-5 7.5mil 0.191mm With DK2.2 for Automotive Radar
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Taconic TLY laminates are a type of low loss laminates. They are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.
Data Sheet of Taconic TLY Material
| TLY TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | 2.2 | 2.2 | ||
| Df at 10 GHz | IPC-650 2.5.5.5 | 0.0009 | 0.0009 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | 0.21 | 0.21 | ||
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | -0.038 | |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | -0.031 | |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | 0.01 | 0.01 | |||
| NASA Outgassing(% CVCM) | 0.01 | 0.01 | |||
| NASA Outgassing(% WVR) | 0.00 | 0.00 | |||
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 | ||
The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.
Benefits:
1. Dimensionally stable
2. Lowest DF
3. Low moisture absorption
4. High copper peel strength
5. Uniform & consistent DK
6. Laser ablatable
Applications:
1. Automotive radar
2. Satellite/cellular communications
3. Power amplifiers
4. LNBs, LNAs, LNCs
5. Aerospace
6. Ka, E and W band applications
PCB Specifications
| PCB SIZE | 76 x 51mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| TLY-5 0.191mm | |
| copper ------- 18um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 10 mil / 10 mil |
| Minimum / Maximum Holes: | 0.4mm / 2.0mm |
| Number of Different Holes: | 0 |
| Number of Drill Holes: | 0 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | TLY-5 |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.25 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | OSP |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | N/A |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
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