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2L 30mil Rogers 4350 PCB High Frequency PCB

Categories RF PCB Board
Brand Name: bicheng
Model Number: BIC-002-V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1 pcs
Price: USD 9.99-99.99 per piece
Payment Terms: T/T
Supply Ability: 50000 pcs per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+ Cartons
Base material:: RO4350B
Thickness: 0.8mm
Copper weight:: 1oz
Surface finish:: immersion gold
Layer count:: 2 layers
PCB size:: 93 x 92 mm
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2L 30mil Rogers 4350 PCB High Frequency PCB


High Frequency PCB 30mil Rogers 4350 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Hydrocarbon ceramic laminates with the part number RO4350B are intended to provide improved high frequency performance and inexpensive circuit manufacturing. Once working frequencies reach 500 MHz and beyond, designers have a much smaller number of laminates to choose from. The qualities required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines are present in the material RO4350B. Since standard circuit board materials cannot be used in many applications due to higher operating frequencies, low dielectric loss makes it possible to employ RO4350B material in these applications.


The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.


PCB Specifications

PCB SIZE93 x 92mm=1PCS
BOARD TYPE
Number of LayersDouble sided PCB, 2 Layer PCB
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 17.8um(0.5oz)+plate TOP layer
RO4350B 30mil (0.762mm)
copper ------- 17.8um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:11.97mil
Minimum / Maximum Holes:0.3/2.8mm
Number of Different Holes:2
Number of Drill Holes:195
Number of Milled Slots:5
Number of Internal Cutouts:0
Impedance ControlNo
BOARD MATERIAL
Glass Epoxy:RO4350B 30mil (0.762mm), Tg 288℃
Final foil external:1oz
Final foil internal:0oz
Final height of PCB:0.8mm ±0.1
PLATING AND COATING
Surface FinishImmersion Gold (16.2%) 2 micoinch over 100 microinch nickel
Solder Mask Apply To:NO
Solder Mask Color:NO
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting, Fiducial Marks
MARKING
Side of Component LegendNO
Colour of Component LegendNO
Manufacturer Name or Logo:N/A
VIAPlated Through Hole(PTH)
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

Typical applications are as follows:

  1. Automotive Radar and Sensors
  2. Cellular Base Station Antennas
  3. Direct Broadcast Satellites
  4. Low Noise Block
  5. Power amplifiers
  6. RFID


Data sheet of Rogers 4350 (RO4350B)

RO4350B Typical Value
PropertyRO4350BDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037
0.0031
Z10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength203(29.5)
130(18.9)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength255
(37)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
32
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280℃ TMAAIPC-TM-650 2.4.24.3
Td390℃ TGAASTM D 3850
Thermal Conductivity0.69W/M/oK80℃ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.86gm/cm323℃ASTM D 792
Copper Peel Stength0.88
(5.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability(3)V-0UL 94
Lead-free Process CompatibleYes

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