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4H-SEMI Polished Sic Wafer lens 2INCH 3INCH 4INCH 9.0 Hardness For Device Material

Categories SiC Substrate
Brand Name: zmsh
Model Number: sic-6inch 4h-n
Place of Origin: china
MOQ: 1pcs
Price: by case
Delivery Time: 15days within
Packaging Details: by customized case
industry: semiconductor substrate
materials: sic crystal
application: 5G, device material, MOCVD,power electronics
Type: 4H-N,semi ,No doped
color: green,blue, white
hardeness: 9.0 up
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4H-SEMI Polished Sic Wafer lens 2INCH 3INCH 4INCH 9.0 Hardness For Device Material

6inch sic substrates, sic ingot ,sic crystal ingots ,sic crystal block, sic semiconductor substrates,6inch Silicon Carbide Wafer,4H-semi SiC wafer,6inch 4H-N type dummy grade sic wafer for test,
1. Description
Property4H-SiC, Single Crystal6H-SiC, Single Crystal
Lattice Parametersa=3.076 Å c=10.053 Åa=3.073 Å c=15.117 Å
Stacking SequenceABCBABCACB
Mohs Hardness≈9.2≈9.2
Density3.21 g/cm33.21 g/cm3
Therm. Expansion Coefficient4-5×10-6/K4-5×10-6/K
Refraction Index @750nm

no = 2.61

ne = 2.66

no = 2.60

ne = 2.65

Dielectric Constantc~9.66c~9.66
Thermal Conductivity (N-type, 0.02 ohm.cm)

a~4.2 W/cm·K@298K

c~3.7 W/cm·K@298K

Thermal Conductivity (Semi-insulating)

a~4.9 W/cm·K@298K

c~3.9 W/cm·K@298K

a~4.6 W/cm·K@298K

c~3.2 W/cm·K@298K

Band-gap3.23 eV3.02 eV
Break-Down Electrical Field3-5×106V/cm3-5×106V/cm
Saturation Drift Velocity2.0×105m/s2.0×105m/s
2. Material Size describtion
6 inch diameter Silicon Carbide (SiC) Substrate Specification
GradeZ gradeP gradeR gradeD grade
    
ZERO MPDProductionResearch GradeDummy Grade
    
Diameter150mm±0.5 mm
Thickness350 μm±25μm or 500±25um or by customized size
Wafer OrientationOff axis : 4.0° toward <1120 > ±0.5° for 4H-N
Micropipe Density≤1cm-2≤5 cm-2≤15 cm-2≤50 cm-2
Resistivity4H-N0.015~0.028 Ω·cm
4/6H-SI>1E5 Ω·cm
Primary Flat{10-10}±5.0°
Primary Flat Length47.5mm±2.5 mm
Edge exclusion3mm
TTV/Bow /Warp≤15μm /≤40μm /≤60μm
RoughnessPolish Ra≤1 nm
CMP Ra≤0.5 nm
NoneNone1 allowed, ≤1 mm
Cracks by high intensity light
Hex Plates by high intensity lightCumulative area≤1 %Cumulative area≤1 %Cumulative area≤3 %
NoneCumulative area≤2 %Cumulative area≤5%
Polytype Areas by high intensity light
 
3 scratches to 1×wafer diameter cumulative length5 scratches to 1×wafer diameter cumulative length8 scratches to 1×wafer diameter cumulative length
Scratches by high intensity light
 
Edge chipNone3 allowed, ≤0.5 mm each5 allowed, ≤1 mm each
Contamination by high intensity lightNone
3. products

FAQ:

Q: What's the way of shipping and cost?

A:(1) We accept DHL, Fedex, EMS etc.

(2) it is fine If you have your own express account ,If not,we could help you ship them and

Freight is in accordance with the actual settlement.


Q: How to pay?

A: T/T 100% deposit before delivery.


Q: What's your MOQ?

A: (1) For inventory, the MOQ is 1pcs. if 2-5pcs it's better.

(2) For customized commen products, the MOQ is 10pcs up.


Q: What's the delivery time?

A: (1) For the standard products

For inventory: the delivery is 5 workdays after you place the order.

For customized products: the delivery is 2 -4 weeks after you order contact.


Q: Do you have standard products?

A: Our standard products in stock. as like substrates 4inch 0.35mm.


Thanks~~~
Product Tags:

sic wafer

  

sic substrate

  
Quality 4H-SEMI Polished Sic Wafer lens 2INCH 3INCH 4INCH 9.0 Hardness For Device Material for sale
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