TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu

TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu​

TIF040-12 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility.

Due to TIF040-12 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF040-12 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility.

TIF040-12 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.

Application
> Mass storage devices
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> vihicel enginee controler

> Telecom industry
> Semiconductor automaticlaboratory equipment.

Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.