| Sign In | Join Free | My frbiz.com |
|
| Sign In | Join Free | My frbiz.com |
|
| Categories | Thermal Conductive Gel |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIF020-19 |
| Certification: | RoHS |
| Place of Origin: | Vietnam |
| MOQ: | 1000tube |
| Price: | 0.1-10 USD/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 1000000 tube/month |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 300cc/tube |
| Products name: | TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel |
| Materail: | Ceramic Filled Silicon Material |
| Color: | Yellow |
| Specific Gravity: | 2.6g/cm³ |
| Thermal conductivity: | 2.0W/mK |
| Continuous Use Temperature: | -45~200℃ |
| Keywords: | Thermal conductive gel |
| Company Info. |
| CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM |
| Verified Supplier |
| View Contact Details |
| Product List |
TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel
TIF020-19 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF020-19 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF020-19 operation mold is simliar as grease ,such as silkprint and screen
print or automatic injected facility. TIF020-19 can be applied on
chip micro processor,PPGAs,Micro BGA package,BGA package,DSP
chip,LED lighting and other high power electric component.
Feature
> Thermal conductivity: 2.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
| TIF®020-19 Typical Properties | ||
| Property | Value | Test method |
| Color | Yellow | Visual |
| Construction & Composition | Ceramic filled silicon material | - |
| Flow Rate(g/min) | 90 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
| Specific Gravity | 2.6g/c | ASTM D297 |
| Thermal conductivity | 2.0W/mK | ISO 22007-2 |
| Impedance @10psi (℃.in²w) | 0.143 | ASTM D5470 |
| Impedance @50psi (℃.in²w) | 0.114 | ASTM D5470 |
| Continuous Use Temperature | -45 ~200°C | ****** |
| Dielectric Strength(V/mm) | ≥4000 | ISO 22007-2 |
| Bond Line Thickness(mm) | 0.1 | Ziitek est Mothod |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
|
TIF040AB-12S Two-Component Thermally Conductive Gel For Heat Dissipation In Network Equipment
TIF020AB-19S Two Component Precuring Thermal Gel For Smart Phone And Tablet Computer
TIF030AB-05S Two Component Liquid Easily Thermal Gap Filling Material Silicone Thermal Gel For Power Semiconductor
TIF030-05 Thermal Conductive Gel Thermal Conductive Silicon Filler Liquid Heat Conducting Gel With Good Price
TIF015-07 Thermal Conductive Gel
TIF035-05 Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat
TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu
TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling
TIF015AB-07S Thermal Conductive Liquid Gap Filler Silicon Gel Electreics Thermally Conductive Gel For CPU COB Computer Laptop
TIF035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel
