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| Categories | Thermal Conductive Silicone Glue |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIS580-25 |
| Certification: | UL and RoHs |
| Place of Origin: | Vietnam |
| MOQ: | 10KG |
| Price: | 0.1-10 USD/kg |
| Payment Terms: | T/T |
| Supply Ability: | 10000KG/month |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 1kg/can |
| Products name: | TIS580-25 One Componen Dealcoholized Room Temperature Cured Thermally Conductive Silicone Glue |
| Material: | Silicone Adhesive |
| Thermal Conductivity: | 2.5W/mk |
| Appearance: | White Paste |
| Hardness: | 45（Shore A） |
| Keywords: | Thermally Conductive Silicone Glue |
| Total Cure Time: | 3-7 Days (25℃) |
| Company Info. |
| CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM |
| Verified Supplier |
| View Contact Details |
| Product List |
TIS580-25 One Componen Dealcoholized Room Temperature Cured Thermally Conductive Silicone Glue
TIS™580-25 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.
TIS™580-25 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.
TIS™580-25 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
Feature
> Good thermal conductivity: 2.5W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Application
| Typical values of TISTM580-25 | ||
| Appearance | White paste | Test Method |
| Density(g/cm3,25℃) | 1.6 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7days | ***** |
| Elongation(psi) | ≥200 | ASTM D412 |
| Hardness(Shore A) | 45 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.5 | ASTM D1876 |
| Peel Strength(N/mm) | ＞5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant ( @ 1MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 2.5 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
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