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One Componen TIS580-10 Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive

Categories Thermal Conductive Silicone Glue
Brand Name: Ziitek
Model Number: TIS580-10
Certification: UL and RoHs
Place of Origin: Vietnam
MOQ: 10KG
Price: 0.1-10 USD/kg
Payment Terms: T/T
Supply Ability: 10000KG/month
Delivery Time: 3-5 work days
Packaging Details: 1kg/can
Products name: One Componen TIS580-10 Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive
Material: Silicone Adhesive
Thermal Conductivity: 1.0W/mk
Appearance: White Paste
Hardness: 45(Shore A)
Keywords: Thermally Conductive Silicone Glue
Total Cure Time: 3-7 Days (25℃)
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One Componen TIS580-10 Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive

One Componen TIS580-10 Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive


TIS™580-10 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.


TIS™580-10 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.

TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.


Feature


> Good thermal conductivity: 1.0W/mK

> Good maneuverability and good adhesion

> Low shrinkage

> Low viscosity, leads to void-free surface

> Good solvent resistance, water resistance

> Longer working life

> Excellent thermal shock resistance


Application


It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-10, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective. E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
Typical values of TISTM580-10
AppearanceWhite pasteTest Method
Density(g/cm3,25℃)1.3ASTM D297
Tack-free time(min,25℃)≤20*****
Cure type(1-component)Dealcoholized*****
Viscosity@25℃ Brookfield (Uncured)30K cpsASTM D1084
Total cure time(d, 25℃)3-7*****
Elongation(%)≥200ASTM D412
Hardness(Shore A)45ASTM D2240
Lap Shear Strength(MPa)≥2.5ASTM D1876
Peel Strength(N/mm)>5ASTM D1876
Operation temperature(℃)-60~250*****
Volume Resistivity(Ω·cm)2.0×1016ASTM D257
Dielectric Strength(KV/mm)21ASTM D149
Dielectric Constant (1.2MHz)2.9ASTM D150
Thermal Conductivity W/(m·K)1.0ASTM D5470
Flame RetardancyUL94 V-0E331100

Package:
300ml/Tube, 24PCS/Box

Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Independent R&D team


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