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TIF100-40-11U Thermal Pad For GPU CPU Chip

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF100-40-11U
Certification: UL and RoHs
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: Thermal Pad For GPU CPU Chip
Thermal Conductivity: 4.0W/mK
Density: 3.15g/cm³
Keywords: Thermal Pad
Color: Gray
Hardness: 27 Shore 00
Dielectric Breakdown Voltage: >5500VAC
Application: GPU CPU Chip
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  • Product Details
  • Company Profile

TIF100-40-11U Thermal Pad For GPU CPU Chip

Thermal Pad For GPU CPU Chip


The TIF™100-40-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-40-11U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.


Features:


> Good thermal conductive: 4.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized
> Moldability for complex parts
> Naturally tacky needing no further adhesive coating


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp


Typical Properties of TIF100-40-11U Series
PropertyValueTest method
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Density3.15g/cm³ASTM D297
Thickness range0.020"(0.5mm)~0.200"(5.0mm)******
Hardness27 Shore 00ASTM 2240
Continuos Use Temp-40 to 160℃***
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant5.0 MHzASTM D150
Volume Resistivity(Ohm-cm)1.0X10¹²ASTM D257
Fire rating94 V0UL E331100
Thermal conductivity4.0W/m-KASTM D5470


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)


Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Company Profile

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


Independent R&D team


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