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TIF100-18-56U Ultra-soft thermal pad

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF100-18-56U
Certification: UL and RoHs
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: Ultra-soft thermal pad
Thermal Conductivity: 1.8W/mK
Density: 2.3g/cm³
Keywords: Thermal Pad
Color: Green
Hardness: 27 Shore 00
Dielectric Breakdown Voltage: >5500VAC
Application: CPU & GPU
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  • Company Profile

TIF100-18-56U Ultra-soft thermal pad

TIF100-18-56U Ultra-soft thermal pad


The TIF™100-18-56U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.



Features:


> Good thermal conductive: 1.8W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components


Typical Properties of TIF100-18-56U Series
PropertyValueTest method
ColorGreenVisual
Construction & CompostionCeramic filled silicone elastomer******
Density2.3g/cm³ASTM D297
Thickness range0.020"(0.5mm)~0.200"(5.0mm)******
Hardness27 Shore 00ASTM 2240
Continuos Use Temp-40 to 160℃***
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant3.7 MHzASTM D150
Volume Resistivity(Ohm-cm)4.0X10¹³ASTM D257
Fire rating94 V0UL E331100
Thermal conductivity1.8W/m-KASTM D5470
Outgassing(TML)0.55%ASTM E595


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)


Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


FAQ:


Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.


Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.


Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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