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Categories | Turnkey PCB Assembly |
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Place of Origin: | China |
MOQ: | Negotiable |
Price: | Negotiable |
Payment Terms: | T/T |
Supply Ability: | 100000pc/Month |
Delivery Time: | 4 Weeks |
Packaging Details: | PCB + Box |
Brand Name: | CUSTOM MADE |
Certification: | ISO/UL |
Keyword: | Turnkey PCB Assembly |
Applications: | Industrial Control, Medical, Automotive Electronics |
Materials: | High-Tg FR4, Rogers, Nelco, RCC, PTFE, FR4 |
PCB boards: | POP Board, Ordinary Board, FPC Board, Rigid-Flex Board, Metal Substrate Boards |
Service: | One-stop Service for PCB and SMT Assembly |
Min Outline Tolerance: | ±0.1mm |
Surface Finished: | HASL Pb Free Immersion Gold/Tin/Silver Osp |
Max Board Size: | 650mm*1130mm |
Payment Method: | T/T |
Whether to Support customization: | Support |
Logistics: | Accept customer specified logistics |
Company Info. |
TONGZHAN INDUSTRIAL LIMITED |
View Contact Details |
Product List |
Turnkey PCB Assembly Automotive Electronics Consumer Electronics
Turnkey PCB Assembly Description:
1. Provide high multilayer PCB manufacturing service.
2. 2-68 layers of samples can be provided for mass production.
3. Ordinary board/HDI board/FPC/rigid-flex joint board/metal base
plate.
Turnkey PCB Assembly Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.3-6.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Turnkey PCB Assembly Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.
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