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Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

Categories Ceramic PCB Board
Brand Name: WITGAIN PCB
Model Number: CeramicPCB0007
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 20 days
Packaging Details: Vacuum bubble bag packaging
Place of Origin:: Guangdong China
Material:: Aluminum Nitride
No of layers:: 2 Layer
Copper Thickness: 1/1 OZ
Surface technics:: ENIG
Board Size: 100mm*100mm
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Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

AIN Ceramic PCB Board Thickness 0.4 MM 1 OZ Copper


Main Features:

1 Part NO: CeramicPCB0007
2 Layer Count: 2 Layer PCB
3 Material Kind: AIN Ceramic
4 Finished Board Thickness: 0.4 MM
5 Copper Thickness: 1/1 OZ
6 PCB Size: 100mm*100mm



Our Product Categories:

Our Product Categories
Material KindsLayer CountsTreatments
FR4Single LayerHASL Lead Free
CEM-12 Layer/Double LayerOSP
CEM-34 LayerImmersion Gold/ENIG
Aluminum Substrate6 LayerHard Gold Plating
Iron Substrate8 LayerImmersion Silver
PTFE10 LayerImmersion Tin
PI Polymide12 LayerGold fingers
AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
Rogers, Isola high frequency materials16 LayerHalf plating holes
Halogen free18 LayerHDI Laser drilling
Copper based20 LayerSelective immersion gold
22 Layerimmersion gold +OSP
24 LayerResin filled in vias



FAQ:

Q: What is HASL - Hot Air Solder Leveling?

A:

HASL (Hot Air Solder Leveling) is a metallic surface finishing technique, which is performed on the outermost layer of the PCB board to protect the exposed copper surfaces like tracks until the component placement and soldering is completed.

The HASL coating is composed of Solder with 63% Tin and 37% Lead, and during the assembly process, this coating gets dissolved with the soldering material.

The HASL Coating is applied as per the steps below:

  1. The process starts with the immersion of the PCB board into a molten tin/lead solution, where all exposed copper area is covered by this solution.
  2. After that, a Hot Air Leveler (HAL) ensures the uniformity of solder deposit by removing the excess solder from the PCB board, using high pressure hot air knives. The purpose of this is to leave a uniform and thin possible layer on the board.
  3. This coating protects the copper traces from corrosion until the board goes in for the assembly process.

Advantages of HASL:

  • Resistance to copper corrosion
  • Excellent wetting capability during the soldering process
  • Provides excellent quality solder joint (solderability) by making component soldering more effective
  • Economical
  • Can be re-worked easily
  • Suitable for Lead-free PCBs
  • Reduce the chances of PCB failure

Limitations of HASL:

  • It offers high thermal stress to the PCB, which results in defects.
  • Due to the inconsistent thickness of HASL coating, it’s not a feasible solution for SMT component placement.
  • Not suitable for PTH (Plated Through Hole) components.
  • Less environment-friendly
Quality Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper for sale
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