High Temperature Standard JEDEC Tray IC Packaging

Discover JEDEC trays that offer the perfect fit, whether you’re packaging standard ICs or proprietary modules.

The tray has a 45-degree chamfer to provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.

Advantage:

FAQ

Q1: Are you a manufacturer?
A: Yes, we are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.

Q2: What information should we supply if we want a quotation?
A: Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
A: Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
A: Normally, 5- 8 days or so.
Q5: Do you inspect the finished products?
A: Yes, we will do an inspection according to the ISO 9001 standard and be ruled by our QC staff.