| Sign In | Join Free | My frbiz.com |
|
| Sign In | Join Free | My frbiz.com |
|
| Categories | JEDEC Matrix Trays |
|---|---|
| Brand Name: | Hiner-pack |
| Model Number: | JEDEC standard tray 322.6*135.9*7.62&12.19mm |
| Certification: | ISO 9001 ROHS SGS |
| Place of Origin: | Made In China |
| MOQ: | 1000 pcs |
| Price: | $1.35~$2.38(Prices are determined according to different incoterms and quantities） |
| Payment Terms: | T/T |
| Supply Ability: | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time: | 5~8 working days |
| Packaging Details: | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material: | MPPO |
| Color: | Black |
| Temperature: | 125°C |
| Property: | ESD, Non-ESD |
| Surface resistance: | 1.0x10E4~1.0x10E11Ω |
| Flatness: | Less than 0.76mm |
| Clean Class: | General and ultrasonic cleaning |
| Incoterms: | EXW, FOB, CIF, DDU, DDP |
| Use: | Transport, Storage, Packing |
| Company Info. |
| Shenzhen Hiner Technology Co.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.
Electronic component; Semiconductor; Embedded System; Display technology; Micro and Nano systems; Sensor; Test and Measurement Technology; Electromechanical equipment and systems; Power supply
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN1890 | Cavity Size | 6*8*1mm |
| Package Type | BGA IC | Matrix QTY | 24*16=384PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Reference to the temperature resistance of different materials:
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature, and other special requirements can be customized | ||
Q1: Are you a manufacturer?
Ans: Yes, we have an ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
Ans: Normally, 3 days. If customized, open a new mold 25~30 days
around.
Q4: How about batch order production?
Ans: Normally, 5- 8 days or so.
Q5: Do you inspect the finished products?
Ans: Yes, we will inspect according to the ISO 9000 standard and be
ruled by our QC staff.
|
Customized Matrix Socket Electronic Component Tray 88PCS Anti Static
Permanent Antistatic JEDEC Matrix Trays For Transport IC Component
Transport IC Components Injection JEDEC Standard Trays With Big Pocket Size
High Temperature Resistant JEDEC Matrix Trays Transport RF IC
Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material
High Temperature Standard JEDEC Tray IC Packaging
BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface
Anti Corrosive Black JEDEC Tray Suppliers Cycle Loading For Nano Sensor
PCB Module Packaging ESD JEDEC Matrix Trays 21PCS High Temperature Resistant
0.76mm Flatness Black QFN MPPO JEDEC Matrix Tray ROHS Approved
