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| Categories | JEDEC IC Trays |
|---|---|
| Brand Name: | Hiner-pack |
| Model Number: | JEDEC standard tray 322.6*135.9*7.62&12.19mm |
| Certification: | ISO 9001 ROHS SGS |
| Place of Origin: | Made In China |
| MOQ: | 1000 pcs |
| Price: | $1.35~$2.38(Prices are determined according to different incoterms and quantities） |
| Payment Terms: | T/T |
| Supply Ability: | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time: | 5~8 working days |
| Packaging Details: | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30mm |
| Material: | MPPO.PPE.ABS.PEI.IDP...etc |
| Color: | Black.Red.Yellow.Green.White..etc |
| Temperature: | 80°C~180°C |
| Property: | ESD,Non-ESD |
| Flatness: | less than 0.76mm |
| Clean Class: | General and ultrasonic cleaning |
| Customized service: | Support standard and non-standard,precision machining |
| Injection mold: | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
| Company Info. |
| Shenzhen Hiner Technology Co.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carrying components or IC of the tray, carrying function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, and improve work efficiency.
The tray has a 45-degree chamfer to provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP etc. We can provide custom service for all packaging methods of the chip tray.
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature, and other special requirements can be customized | ||
1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly
as possible. So we can send you the offer for the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.
3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your
clear description of the IC or component. Provide one-stop service
from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the
one that is the most convenient or cost-effective for you.
5. How to guarantee quality?
Reply: Our samples through strict testing, the finished products
comply with the international JEDEC standards, to ensure a 100%
qualified rate.
|
JEDEC Standard LGA IC Semiconductor Tray HIPS Materials Non ESD
JEDEC IC Trays ESD Durable PPE SGS Approved
ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant
Customized Black ESD JEDEC IC Trays Ultrasonic Cleaning For PCBA Module
Antistatic PPE Standard JEDEC ESD Protect Module Tray
High Temperature Resistance PPO JEDEC IC Trays Durable ESD
Regular Size Colorful Antistatic Shipping Trays Thermostable For IC Component
PPE MPPO Anti-static Standard JEDEC Tray Avoiding Manual Picking
High Temperature Resistance JEDEC IC Trays
ROHS Black ESD JEDEC Tray High Temperature Resistant For LGA IC Chips
