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ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

Categories JEDEC IC Trays
Brand Name: Hiner-pack
Model Number: HN1903
Certification: ISO 9001 ROHS SGS
Place of Origin: Made In China
MOQ: 1000 pcs
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day
Delivery Time: 5~8 working days
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Material: MPPE
Color: Black
Temperature: 140°C
Property: ESD
Surface resistance: 1.0x10E4~1.0x10E11Ω
Flatness: less than 0.76mm
Clean Class: General and ultrasonic cleaning
Incoterms: EXW,FOB,CIF,DDU,DDP
Customized service: Support standard and non-standard,precision machining
Injection mold: Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.)
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ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

Go beyond off-the-shelf—get JEDEC trays engineered for your chip’s shape, height, and transportation needs.

While the JEDEC Tray is widely used in the semiconductor industry, the PCB module market is slowly recognizing and using custom trays to transport and load modules, because it can not only fully meet customer requirements in terms of performance, but also match the market demand for high-end modules. The IC Tray has been fully recognized in different industries. We have accumulated a wealth of experience in loading different ICs and modules, and have produced many similar series of trays.

The tray has a 45-degree chamfer to provide a visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.

Application:

Package IC, PCBA module component, Electronic component packaging, Optical device packaging

Technical Parameters:

BrandHiner-packOutline Line Size322.6*135.9*7.62mm
ModelHN1903Cavity Size43*38*3.25mm
Package TypePCB ModuleMatrix QTY6*3=18PCS
MaterialPPEFlatnessMAX 0.76mm
ColorBlackServiceAccept OEM, ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateRoHS

Reference to the temperature resistance of different materials:

MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature, and other special requirements can be customized


FAQ:

1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time.
For purchasing or further discussion, it is better to contact us via Skype / Email / Phone / WhatsApp, in case of any delays.

2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.

3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component. Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the one that is the most convenient or cost-effective for you.

5. How to guarantee quality?
Reply: Our samples through strict testing, and the finished products comply with the international JEDEC standards, to ensure a 100% qualified rate.

Quality ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant for sale
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