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| Categories | Rogers PCB Board |
|---|---|
| Brand Name: | Bicheng Technologies Limited |
| Model Number: | BIC-93xx-V1.33 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD 2.88-6.99 per piece |
| Payment Terms: | T/T, Paypal |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 4-5 working days |
| Packaging Details: | Vacuum |
| Number of Layers: | 2 Layer, Multilayer, Hybrid type (Mixed) |
| Glass Epoxy: | RT/duroid 5880 |
| Final height of PCB: | 10mil (0.254mm), 20mil (0.508mm) 31mil (0.787mm), 62mil (1.575mm) |
| Final foil external: | 0.5oz, 1oz, 2oz |
| Surface Finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
| Solder Mask Color: | Green, Black, Blue, Yellow, Red etc. |
| Colour of Component Legend: | Green, Black, Blue, Yellow, Red etc. |
| Test: | 100% Electrical Test prior shipment |
Hello everyone,
Today, we introduce high frequency PCB built on RT/duroid 5880 laminates.
RT/duroid 5880 is one of Rogers’ glass microfiber reinforced PTFE composite which is designed for exacting stripline and microstrip circuit applications.
Why do we use RT/duroid 5880?
Firstly, the randomly oriented microfibers result in exceptional dielectric constant uniformity.
Secondly, the dielectric constant of RT/duroid 5880 laminates is uniform from panel to panel and is constant over a wide frequency range.
Thirdly, its low dissipation factor extends the usefulness of RT/duroid 5880 laminates to Ku-band and above. It’s as low as 0.0004 when 1 MHz and 0.0009 when 10 GHz.
Fourthly, designed for exacting stripline and microstrip circuit applications
| PCB Capability | |
| PCB Material: | Glass microfiber reinforced PTFE composites |
| Designation: | RT/duroid 5880 |
| Dielectric constant: | 2.2 ±0.02 (process) |
| 2.2 (design) | |
| Layer count: | 2 Layer, Multilayer, Hybrid type (Mixed) |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 31mil (0.787mm), 62mil (1.575mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, etc.. |
RT/duroid 5880 material can be made in double layer board, multilayer board and hybrid types. The double sided boards are available in a variety of thicknesses, such as 10mil, 20mil, 31mil and 62mil.
The typical applications are microstrip and stripline circuits, commercial airline broadband antenna,radar systems, millimeter wave applications, point to point digital radio antenna etc.
The basic colour of RT/duroid 5880 PCB is black.
RT/duroid 5880 PCB also has the properties of low water absorption, excellent chemical resistance etc.
If you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Typical Value of RT/duroid 5880
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0004 0.0009 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X | ||||
| 860(125) | 380(55) | Y | ||||
| Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
| 27(3.9) | 18(2.6) | Y | ||||
| Ultimate Strain | 6 | 7.2 | X | % | ||
| 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y | ||||
| 940(136) | 670(97) | Z | ||||
| Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
| 29(5.3) | 21(3.1) | Y | ||||
| 52(7.5) | 43(6.3) | Z | ||||
| Ultimate Strain | 8.5 | 8.4 | X | % | ||
| 7.7 | 7.8 | Y | ||||
| 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 31 48 237 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
|
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