Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold

Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers’ TMM10i thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.

The electrical and mechanical properties of TMM10i laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.

TMM10i laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM10i laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.

TMM10i laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.

Some Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

Our Capabilities (TMM10i)

Data Sheet of TMM10