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Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking

Categories Silicone Free Gap Filler Pad
Brand Name: ZIITEK
Model Number: Zpaster180-20-11F
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 days
Packaging Details: 1000pcs/bag
Products name: Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking
Color: Dark Grey
Thickness: 2mmT
Model: Z-paster180-20-11F
Thermal conductivity: 2 W/mK
Dielectric Constant: 5.5 MHz
Keywords: Silicone Free Gap Filler Pad
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  • Product Details
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Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking

Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Z-paster180-20-11F is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.


It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Z-Paster100-20-11F Series Datasheet-(E)-REV01.pdf


Features


>Silicone-free

>ROSH compliance

>Good thermal conductive:2.0 W/mK

>Soft and Compressible for low stress applications

>Available in varies thickness


Application


>Cooling components to the chassis of frame

>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
>Automotive electronics

Typical Properties of Z-Paster180-20-11F Series
ColorDark GrayVisualDielectric Breakdown Voltage (T= 1mm above)>5000 VACASTM D149
ConstructionSilicone-free The metal oxide fills**********Dielectric Constant5.5 MHzASTM D150
Thermal Conductivity2.0 W/mKASTM D5470Volume Resistivity6.0X1013 Ohm-meterASTM D257
Hardness65 Shore 00ASTM 2240Continuous Use Temp– 20 To 125 **********
Specific Gravity2.68 g/ccASTM D297Outgassing (TML)0.30%ASTM E595
Thickness2mmTASTM D374Flame Rating94 V-0

equivalent to


Standard size

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.



FAQ:


Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.


Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

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