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2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module

Categories Silicone Free Gap Filler Pad
Brand Name: ZIITEK
Model Number: Z-Paster100-20-11S
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 days
Packaging Details: 1000pcs/bag
Product name: 2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module
Color: Drak Gray
Hardness: 50 Shore 00
Thickness: 0.25mmT~5.0mm
Dielectric Constant: 5.5 MHz
Key words: Silicone Free Thermal Pad
Specific Gravity: 2.65g/cc
Thermal conductivity: 2.0W/mK
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  • Product Details
  • Company Profile

2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module

2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module


Company Profile


Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Z-Paster100-20-11S Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.
The roleis to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. lt applies to the liner based on silicone suitably.The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Z-Paster100-20-11S-Series-Datasheet-REV01.pdf



Features


> Silicone-free

> ROSH compliance

> Good thermal conductive:2.0W/mK

> Soft and Compressible for low stress applications

> Available in varies thickness


Application


> Cooling components to the chassis of frame

> Car Battery & Power Supply

> Charging Pile

> Silicone-sensitive applications

> Graphics Card Thermal Module

> Set Top Box

> Medical devices

> LED Lighting

> SFP optical module

> Miniature heat tube radiator


Typical Properties of Z-Paster100-20-11S Series
ColorDark grayVisualDielectric Breakdown Voltage (T= 1mm above)>5000 VACASTM D149
ConstructionSilicone-free The metal oxide fills**********Dielectric Constant5.5 MHzASTM D150
Thermal Conductivity2.0 W/mKASTM D5470Volume Resistivity6.0X1013 Ohm-meterASTM D257
Hardness50 Shore 00ASTM 2240Continuous Use Temp– 20 To 125 ℃**********
Specific Gravity2.65 g/ccASTM D297Outgassing (TML)0.30%ASTM E595
Thickness0.020"-0.200"(0.25mm~5.0mm)ASTM D374Flame Rating94 V-0equivalent to

Standard size

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.



Packaging Details & Lead time


The packaging of Silicone free thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


Quality 2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module for sale
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