Microjet Laser Technology Equipment Wafer Slice Metal Silicon Carbide Material

Microjet laser technology equipment wafer slice metal silicon carbide material

Microjet Laser systems enable ultra-precision machining of semiconductor materials by coupling high-energy pulsed lasers to micron-scale liquid jets (usually deionized water or inert liquids), using the guiding and cooling effects of the liquid jets.

With high precision, low damage and high cleanliness, microjet laser technology is replacing traditional machining and dry laser processes in the semiconductor field, especially in third-generation semiconductors (SiC/GaN), 3D packaging and ultra-thin wafer processing.

Microjet laser processing

Technical specifications

Microjet laser equipment technical advantages

1. Small loss of processing materials and processing equipment

2. Greatly reduce grinding links

3. Low labor cost of automated processing

4. High quality machining wall and cutting edge

5. Clean processing without environmental pollution

6. High processing efficiency

7. High processing yield

Microfluidic laser silicon wafer scribing

Test with the debugging processing parameters, and the cutting effect is shown in the figure below. The cutting width of 40μm nozzle is 35um; After the cutting is completed, the wafer is completely scratched, and the back of the cutting tape (UV film) is basically intact and not scratched through. There is no cracking and crack on the edge of the crossing, which meets the processing requirements.