SiC Diamond Wire Cutting Machine Precision Guidance SiC Crystal Rod Cutting

SiC diamond wire cutting machine Precision guidance SiC crystal rod cutting

Silicon carbide cutter is a kind of equipment specially used for cutting silicon carbide (SiC) ingot, mainly used to divide large size silicon carbide ingot into smaller chunks or segments for subsequent processing. Silicon carbide as a kind of high hardness, high wear resistant material, its cutting needs special equipment and technology, silicon carbide cutter is designed for this efficient tool.

Characteristics of SiC diamond wire cutter

· High cutting efficiency: Using diamond cutting wheel or line saw, can quickly cut high hardness silicon carbide ingot.

· High stability: The equipment structure is stable, suitable for long-term continuous work.

· Low pollution: Use coolant to reduce dust and keep the working environment clean.

· Easy operation: Equipped with automatic control system, easy operation and high cutting precision.

Technical specifications

Design advantage

1. The two active cutting wheels of the cutting system are driven by motors to cut
High efficiency, good cutting quality;
2. Single machine to achieve multi-specification silicon carbide end processing and circular cutting function;
3. Device operation interface The device is simple and easy to operate;
4. Fully closed external protection, cutting process to avoid dust pollution, low noise.

The effect of SiC diamond wire cutter

The silicon carbide cutter can efficiently and accurately cut large size SiC ingot into standard crystal blocks, the cutting accuracy can reach ±0.1mm, and the section flatness is controlled within 5μm. This high-precision cutting ensures a 15-20% increase in material utilization during subsequent slicing operations, while reducing edge losses during wafer preparation. Using diamond wire saw technology, cutting loss is only 0.3-0.5mm, compared with the traditional cutting method to save more than 20% of raw material costs. The cut wafers can be directly used to prepare 4- to 8-inch SiC wafers to meet the demanding substrate material requirements of power semiconductor devices such as MOSFET and SBD.

ZMSH service

We provide silicon carbide cutting machine sales, leasing and supporting technical services, including equipment selection guidance, process parameter optimization, operator training and after-sales maintenance support, while providing customized cutting solutions according to customer needs.