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State-of-the-Art Solder Paste Machine for 03015 Components and 0.25 Pitch Applications

Categories Solder Paste Machine
Brand Name: GKG
Model Number: G9+
Certification: CE,TUV,ROHS
Place of Origin: China
MOQ: 1 set
Price: Negotiation
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 100 sets per month
Delivery Time: 7-15days
Packaging Details: Wooden Package
Product name: High-end Solder paste printing machine
Other name: Automatic Screen Printing Machine
PCB size: 50x50~450x340mm
Transport height: 900±40mm
Air pressure: 4-6kgf/cm³
PCB thickness: 0.4-6mm
Max board weight: 5kg
Machine weight: 1000kg
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State-of-the-Art Solder Paste Machine for 03015 Components and 0.25 Pitch Applications

Automatic Solder Paste Printer for Industrial 4.0 MES System


Introduction


The G9+ Automatic Solder Paste Printing Machine is a top-tier piece of equipment specifically designed for advanced SMT applications. It excels in handling the rigorous printing requirements of 03015 components and 0.25 pitch, while delivering exceptional precision and high-speed performance.


Specification


ModelG9+
Max PCB Size450x340mm
Min PCB size50x50mm
PCB thickness0.4-6mm
Max board weight5kg
Transport height900±40mm
Board edge gap2.5mm
Board height15mm
Transport directionL-R,R-L
Transport speedmax 1500mm/s, program control
Transport methodOne stage
WIdth adjustmentautomatic
I/O interfaceSMEMA
PCB positioning (support method)Magnetic pin/support block/manual up-down table
PCB clamping system
Patented over the top clamping
Side clamping
Adsorption function
Print snap-off
0-20mm
Print mode
one/twice
Print Speed
10-200mm/sec
Print Mode
One /Twice
Squeegee Type
Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
Print pressure0.5-10kg
Template fram size470*370mm~737*737mm(20-40thickness)
Cleaning System
Droops of rain type cleaning system
Reinforced vacuum absorption
Dry, wet vacuum three modes
Back and forth cleaning
CCD FOV
10x8mm
Fiducial mark typesStandard Fiducial mark shape
Pad
Hole
Camera systemLook up/down optics structure
CCD digital camera
Geometry pattern match

Machine Performance


ModelG9+
Repeat position accuracy±12.5um@6,CPK≥2.0
Print accuracy±18um@6,CPK≥2.0
Print cycle time<7.5 sec
Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision

Whole Machine Specification


Power supply
AC:220±10%,50/60HZ, 3.0KW
Air pressure
4~6 kgf/cm²
Air consumption
around 5L/min
Operating temperature
-20℃~+45℃
Operating humidity
30%~60%

Machine Dimensions(without tower light)

1172(L) x 1385(W) x 1530 (H)mm
Machine Weight
Approx: around 1000Kg

Features


  1. Advanced CCD Digital System: Incorporating a cutting-edge optical path system, the CCD digital system offers uniform circular illumination and high-brightness coaxial lighting. Dual light source systems provide infinite brightness adjustment, facilitating the recognition of diverse and even uneven mark points on tin-plated, copper-plated, silver-plated, hot air-soldered surfaces, FPC, and various PCB colors.

  2. High-Precision PCB Thickness Adjustment Mechanism: Featuring a robust structure with stable XY movement, manual adjustment allows for seamless accommodation of different PCB thicknesses.

  3. Innovative Guide Rail Positioning System: This system boasts a detachable pattern guide rail and a programmable flexible side clamp, tailored for addressing FPC and PCB warpage. A unique clamping plate device ensures precise positioning, while software programming facilitates automatic stretching and retraction to adapt to varying PCB thicknesses.

  4. Revolutionized Squeegee Structure Design: The new squeegee structure incorporates a comprehensive system that significantly enhances stability and prolongs the lifespan.

  5. Efficient High-Speed Stencil Cleaning: The downward dispensing cleaning structure effectively prevents clogged openings, a frequent cause of ineffective cleaning. Software control allows for easy adjustment of the solvent dispensed length.

  6. Intuitive Multi-Function Interface: Designed for simplicity, clarity, and user-friendliness, the interface includes real-time temperature and humidity monitoring functions, enabling users to monitor and adjust conditions effortlessly as required.

Shenzhen Hansome Technology Co., Ltd. (HSTECH) specializes in manufacturing SMT board handling equipment, including Loaders, Unloaders, Buffers, Conveyors, and more. As a high-tech enterprise with independent intellectual property rights, our company focuses on the research, development, production, and sales of board handling equipment for SMT/THT production lines.

Our team comprises professional technicians and sales personnel who leverage high-tech solutions to provide our customers with efficient and reliable board handling equipment. Our experienced engineering team stays abreast of smart factory trends, continually updating our products and technology to meet market demands. We strive to create more automated and cost-effective products and offer OEM services tailored to our customers' specific needs.


Quality State-of-the-Art Solder Paste Machine for 03015 Components and 0.25 Pitch Applications for sale
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