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Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

Categories Thermal Gap Filler
Brand Name: ZIITEK
Model Number: TIF100-16-38UF
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 10000/day
Delivery Time: 3-5work days
Packaging Details: 1000pcs/bag
Products name: LED Light 2.5 W/m.k Thermal Silicon Pad Thermal Conductive Pad Thermal Gap Pad With Thermal Management Solution
Thickness: Available In Varies Thicknes
Keywords: Thermal Gap Pad
Hardness: 80±5 Shore 00
Construction & Compostion: Ceramic filled silicone rubber
Specific Gravity: 2.1 g/cc
Heat Capacity: 1 l /g-K
Thermal conductivity: 1.6W/mK
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Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

Manufacturer Supplier Custom Laptop 1.W 1mm 1.5mm 2mm 3mm Hard Drive Cpu GPU Thermal Gap Filler


The TIF100-16-38UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


TIF100-16-38UF-Series-Datasheet-rev3.pdf



Features:


> Good thermal conductive: 1.6 W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating



Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions


Typical Properties of TIF100-16-38UF Series
Color

Pink

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm0.36
20mils / 0.508 mm0.41
Specific Gravity
2.1 g/ccASTM D297

30mils / 0.762 mm

0.47

40mils / 1.016 mm

0.52
Heat Capacity
1 l /g-KASTM C351

50mils / 1.270 mm

0.58

60mils / 1.524 mm

0.65

Hardness
65 Shore 00ASTM 2240

70mils / 1.778 mm

0.72

80mils / 2.032 mm

0.79
Tensile Strength

45 psi

ASTM D412

90mils / 2.286 mm

0.87

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.01

120mils / 3.048 mm

1.09
Dielectric Breakdown Voltage
>5500 VACASTM D149

130mils / 3.302mm

1.17

140mils / 3.556 mm

1.24
Dielectric Constant
5.5 MHzASTM D150

150mils / 3.810 mm

1.34

160mils / 4.064 mm

1.42
Volume Resistivity
1.0X10¹² Ohm-meterASTM D257

170mils / 4.318 mm

1.50

180mils / 4.572 mm

1.60
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.68

200mils / 5.080 mm

1.77
Thermal conductivity
1.6W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile


Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.



Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Quality Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K for sale
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