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Precision Solder Paste Machine for Industrial 4.0 MES System Compatibility

Categories Solder Paste Machine
Brand Name: GKG
Model Number: G9+
Certification: CE,TUV,ROHS
Place of Origin: China
MOQ: 1 set
Price: Negotiation
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 100 sets per month
Delivery Time: 7-15days
Packaging Details: Wooden Package
Product name: High-end Solder paste printing machine
Other name: Automatic Screen Printing Machine
PCB size: 50x50~450x340mm
Transport height: 900±40mm
Air pressure: 4-6kgf/cm³
PCB thickness: 0.4-6mm
Max board weight: 5kg
Machine weight: 1000kg
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Precision Solder Paste Machine for Industrial 4.0 MES System Compatibility

Precision Solder Paste Machine for Industrial 4.0 MES System Compatibility


Introduction


The G9+ Fully Automatic Solder Paste Printer is a high-end machine for SMT high end applications and fulfils the requirements of 03015, 0.25 pitch, high precision and high speed printing processes.


Specification


ModelG9+
Max PCB Size450x340mm
Min PCB size50x50mm
PCB thickness0.4-6mm
Max board weight5kg
Transport height900±40mm
Board edge gap2.5mm
Board height15mm
Transport directionL-R,R-L
Transport speedmax 1500mm/s, program control
Transport methodOne stage
WIdth adjustmentautomatic
I/O interfaceSMEMA
PCB positioning (support method)Magnetic pin/support block/manual up-down table
PCB clamping system
Patented over the top clamping
Side clamping
Adsorption function
Print snap-off
0-20mm
Print mode
one/twice
Print Speed
10-200mm/sec
Print Mode
One /Twice
Squeegee Type
Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
Print pressure0.5-10kg
Template fram size470*370mm~737*737mm(20-40thickness)
Cleaning System
Droops of rain type cleaning system
Reinforced vacuum absorption
Dry, wet vacuum three modes
Back and forth cleaning
CCD FOV
10x8mm
Fiducial mark typesStandard Fiducial mark shape
Pad
Hole
Camera systemLook up/down optics structure
CCD digital camera
Geometry pattern match

Machine Performance


ModelG9+
Repeat position accuracy±12.5um@6,CPK≥2.0
Print accuracy±18um@6,CPK≥2.0
Print cycle time<7.5 sec
Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision

Whole Machine Specification


Power supply
AC:220±10%,50/60HZ, 3.0KW
Air pressure
4~6 kgf/cm²
Air consumption
around 5L/min
Operating temperature
-20℃~+45℃
Operating humidity
30%~60%

Machine Dimensions(without tower light)

1172(L) x 1385(W) x 1530 (H)mm
Machine Weight
Approx: around 1000Kg

Features


1.CCD digital system, new all-optical system, uniform ring light and high brightness coaxial light source. Adopting double light source system, the brightness can be adjusted by stepless loop, which can easily identify different solder joints (including uneven solder joints), such as tin-plated, copper-plated, silver-plated, hot-air soldering, FPC, and all kinds of PCBs with different colours.

2.High precision PCB thickness adjustment, extremely reliable structure, stable XY movement. Manual adjustment can easily adapt to different PCB thickness.

3.Guideway positioning system, new pattern guideway disable, programmable flexible side clamp, for FPC, PCB warping, perform unique clamping device. Through software programming can automatically extend and withdraw unaffected PCB board warpage.

4. New innovative scraper structure design with comprehensive scraper system for improved stability and service life.

5. High-speed stencil cleaning with downward distribution cleaning structure successfully prevents clogging of openings (which has been the root cause of poor cleaning results). The length of solvent distribution can also be easily adjusted through software control.

6. New multi-functional interface, simple and clear, user-friendly. Actual temperature and humidity monitoring function.


About Packaging


Quality Precision Solder Paste Machine for Industrial 4.0 MES System Compatibility for sale
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