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| Categories | New Energy PCB Assembly |
|---|---|
| Brand Name: | Suntek |
| Model Number: | F016-006 |
| Certification: | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin: | China or Cambodia |
| MOQ: | 1 |
| Price: | Customized products |
| Payment Terms: | TT,Paypal |
| Delivery Time: | 5-7days after all components kitted |
| Packaging Details: | By ESD bags and carton |
| Material: | FR4(Tg130-Tg180) |
| Thickness: | 0.4mm-5mm |
| Layer: | 1L-32L |
| Size at max.: | 1200*400mm |
| Hole min.: | 0.1mm |
| Copper: | 0.5--10OZ |
| Surface: | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Solder mask: | Green,Blue,Black,Red,White,Matt color |
| Company Info. |
| Suntek Electronics Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
2mm PCB Assembly for New Energy products with RoHs and ISO9001 certified
A Contract Electronics Manufacturing Services Provider
Suntek Capability:
| Quality Grade | Standard IPC 2-3 |
| Assembly Technology | • SMD Stencils •PCB Fabrication • SMT PCB Assembly • THT assembly •
Cable and Wire Harness Assembly • Conformal Coating • Box Build Assembly • Final product assembly |
| Value Added Services | • Component Sourcing • Packing and delivery • DFM • Packing and
delivery • PCBA sample • Rework • IC Programming • NPI Report |
| Company Certifications | • ISO9001 • IATF16949 • ISO13485 • UL |
| Order Capacity | • No requirements of MOQ (Minimum Order Quantity) |
| Testing Process | • QC manual inspection • SPI(Solder Paste Inspection) • X-ray •
FAI(first article inspection) • ICT • FCT • Aging test • Reliability test |
One-Stop Solution EMS Service:
| OEM service | |||
| Layers | 1-32 Layers | Copper weight | 0.5 oZ~10 oZ |
| Material | FR4(Tg 135-Tg180) 94v0,Rogers,Aluminum | Board cutting | Shear,V-score,tab-routed |
| Board type | Rigid, flexable, rigid-flexable | Silk screen | Single double-sided green LPI etc |
| Board shape | Rectangular,round,slots,cutouts etc | Design file format | Gerber, CAD,.BRD |
| Board Thickness | 0.2~5.0mm,Flex 0.01~0.25“ | Bom format | Excel,PDF |
PCB Assembly
1)Our Equipments include Desen Printing press,Samsung SMT, JT lead-free re-flow ovens,
lead-free wave-soldering,BGA rework base,AI machine.
2) Surface mount,through-hole,BGA,QFP and QFN,0201 parts assembling.
3) AOl testing(X-ray for BGA package) for every piece board.
4)First article inspection before SMD process and First completed sample before DIP process.
5)Programming and function testing .
6)Conformal coating and Glue
PCBA/Wire Harness/Box build Quality System:
PCB Assembly equipments:
|
Electronic PCB Board Assembly New Energy Equipment PCBA 1-30Layer FR4 TG170 PCB
Electronic Circuit Board Assembly Electric Power PCBA Board Assembly SMT
PCB Assemblies For Energy Generation And Control New Energy Power Pcba Assembly
New Energy Automobile PCB Assembly 0.5-6oz Copper Gold Surface Finish 4mil/4mil
Energy PCBA Manufacturing Industry Advanced Gold Plated FR-4 PCB Assembly
Advanced Energy Electronics Assembly Business Services 2-20 Layer FR4 6oz
Customized Pcb Assembly Circuit Card Assy 100% Electrical Testing Green Solder Mask
Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection
Double Sided Pcb Assembly Process HASL ENIG OSP New Energy Circuit Board With Standoffs
Automotive Pcba Bga PCB Assembly FR-4 ENIG FPC PCB Green Blue Solder Mask 4mil Trace
