Wear Resistant T0263/247/Plastic Seal MGP Mold For Semiconductor Manufacturing

Technical Parameters

1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design;

2. Cavity Bar uses high-speed powder steel, hardness HRC62-64;

3. Surface vacuum coating, the life span is not less than 300,000 times;

4. The roughness of the cavity can achieve 0.2um.max;

5. Special products can increase the design of vacuum and built -in core pumping mechanisms;

FAQ:

• Q: What is the brand name of this product?
• A: The brand name of this product is TJIN.
• Q: What is the model number of this product?
• A: The model number of this product is 007.
• Q: Where is this product made?
• A: This product is made in China.
• Q: What certification does this product have?
• A: This product is certified by ISO9001.
• Q: What is the minimum order quantity for this product?
• A: The minimum order quantity for this product is 1.
• Q: How is this product packaged?
• A: This product is packaged in wooden packaging.
• Q: How long does it take for this product to be delivered?
• A: It takes 40 days for this product to be delivered.
• Q: What are the payment terms for this product?
• A: The payment terms for this product are TT (Telegraphic Transfer).

Superiority

1. Use imported raw materials, use imported advanced equipment manufacturing and testing;

2. Customized on demand, the mold accuracy is high, the performance is stable, and the life of the mold is high;

3. Advanced technology, ensuring quality, responsible for installation and debugging, providing high -quality services permanently, high quality and low price.
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Thank you for considering TJIN's high-quality and precision MGP Mold customized service for your chip packaging needs.

As a leading manufacturer of MGP Mold in China, we take pride in our brand and guarantee the highest level of quality and reliability. Our MGP Mold model number 007 is specially designed for chip packaging and is widely used by leading companies in the industry.

Our MGP Mold is manufactured in China, and our production process is certified by ISO9001, ensuring the highest standards of quality and efficiency. Our minimum order quantity is 1, allowing you to order the exact number of molds you need without any excess.

To ensure safe transportation, our MGP Mold is packed in high-quality wooden packaging, providing maximum protection during shipping. Our delivery time is 40 days, and we accept TT as our payment terms.

Our MGP Mold is designed with a mirror polishing surface treatment, providing a smooth and flawless finish for your chips. Our ejection system includes ejector pins, ejector sleeves, and ejector blades, ensuring easy and efficient ejection of your chips.

We offer the option of both hot runner and cold runner systems for our MGP Mold, allowing you to choose the most suitable system for your chip packaging needs. Our lead time for customization is 4-8 weeks, providing quick and efficient delivery of your customized MGP Mold.

For efficient cooling of your chips, our MGP Mold offers both water cooling and air cooling systems, providing optimal performance for your chips.

Choose TJIN's MGP Mold customization service for your chip packaging needs and experience the highest level of quality and reliability. Contact us now to get started on your customized MGP Mold order.

Packing and Shipping:

Our MGP Mold products are carefully packaged and shipped to ensure their safe arrival. Each product is wrapped in protective material and placed in a sturdy box to prevent any damage during transportation.

We also offer customized packaging options for bulk orders, ensuring that all products are securely packed and labeled for easy identification.

For international shipments, we use reliable shipping carriers to ensure timely delivery and provide tracking information for our customers.

Upon arrival, our products are inspected for quality and any issues are promptly addressed to ensure customer satisfaction.

Thank you for choosing MGP Mold for your packaging and shipping needs.

Technical Parameters:

Product Description:

Semiconductor MGP Mold, High-Life MGP Mold , High-Quality MGP Mold, Efficient MGP Mold, Precise MGP Mold

MGP Mold is a high-quality and efficient mold designed for the semiconductor industry. It is perfect for producing precise and complex products with a smooth surface finish. The mold is available in both water cooling and air cooling systems, as well as hot runner and cold runner systems, providing flexibility and customization options for our clients.

MGP Mold offers two cooling system options for our clients: water cooling and air cooling. The water cooling system is ideal for faster cooling and higher precision, while the air cooling system is more cost-effective and suitable for less complex products. Both systems ensure efficient and consistent cooling for optimal mold performance.

Our mold is available in both hot runner and cold runner systems to suit different production needs. The hot runner system is recommended for high-volume production and can reduce material waste, while the cold runner system is suitable for smaller production runs and offers cost-saving benefits. Whichever system you choose, our MGP Mold guarantees efficient and precise molding results.

MGP Mold is designed and manufactured according to international standards including DME, HASCO, LKM, or can be customized to meet specific requirements. Our mold is built with precision and consistency, ensuring high-quality products and smooth production processes.

Our MGP Mold is equipped with the latest technology for mirror polishing, providing a flawless and smooth surface finish for your products. This not only enhances the overall appearance of the product but also reduces the need for additional post-processing, saving time and costs.

At MGP Mold, we understand the importance of timely production for our clients. Our lead time for delivering a fully functional mold ranges from 4 to 8 weeks, depending on the complexity of the product and the customization requirements. Our efficient and streamlined production process ensures that we deliver your mold on time without compromising on quality.

In conclusion, MGP Mold is the perfect solution for the semiconductor industry, offering high-quality, efficient, and precise molds that meet international standards. With our customizable cooling and runner systems, we provide flexibility and tailored options for our clients. Our advanced surface treatment technology and timely delivery make us a reliable and trusted partner for all your molding needs. Choose MGP Mold for the best results in your production process.

Features:

• Product Name: MGP Mold
• Mold Standard: DME, HASCO, LKM Or Customized
• Surface Treatment: Mirror Polishing
• Design Software: UG, ProE, Solidworks, AutoCAD
• Cooling System: Water Cooling Or Air Cooling
• Gate Type: Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
• High-Life MGP Mold
• Chip Packaging MGP Mold
• High-Quality MGP Mold

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.