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Real-Time X-Ray Machine With 5 Micron Focus X-Ray Tube For BGA Soldering Balls Checking

Categories Electronics X Ray Machine
Brand Name: UNICOMP
Model Number: AX8200
Certification: CE, FDA
Place of Origin: China
MOQ: 1Set
Price: can negotiate
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Delivery Time: 30 days
Packaging Details: Wooden Case, Waterproof, Anti-collision
Tube Voltage: 0~90kV
Industry: Electronics Industry
Size: 1280(W)×1500(D)×1700(H)mm
Weight: 1520 kg
Power Consumption: 2.0 kW
Company Info.
Unicomp Technology
Verified Supplier
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Real-Time X-Ray Machine With 5 Micron Focus X-Ray Tube For BGA Soldering Balls Checking

X-Ray Inspection Machine Electronics BGA Standard Multifunction


Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to advance the core technology of X-ray imaging. Presently Unicomp has submit a total of 256 patents with 199authorized. Unicomp has obtained numerous management system certification, such as ISO 9001 quality management system, ISO 14001 environmental management system, OHSAS18001 occupational health & safety management system, as well as ISO27001 information safety management system.


The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)



Applications:


BGA , CSP , LED , Flip Chip , Semiconductor,


Battery Industry , Small Metal Casting,


Electronic Connector Module,


Aerospace Components , Photovoltaic Industry,


Other Special Industries.


Item

Definition

Specs

System Parameters

Size

1280(W)×1500(D)×1700(H)mm

Weight

1370 kg

Power

AC 110~220V, 50/60Hz

Power Consumption

2.0 kW

X-ray Tube

Type

Sealed

Max.Voltage

90kV/100kV

Max.Power

8W

Spot Size

5μm

X-ray System

Detector

Flat Panel Detector (FPD)

Monitor

24’’ FHD Interactive Touch LCD Display

System Magnification

600x

Detection Region

Max. Loading Area

610*610mm

Max.Inspection Area

550*550mm

X-ray Leakage

< 1uSv/h



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