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0.8mm DiClad 870 PCB With Hot Air Solder Leveling For Digital Radio Antennas

Categories Multi Layer PCB
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
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0.8mm DiClad 870 PCB With Hot Air Solder Leveling For Digital Radio Antennas

Introduction

Today we'll be discussing a high-frequency PCB with a lower dielectric constant called DiClad 870 microwave PCB.


DiClad 870 is a Rogers laminate that utilizes woven fiberglass reinforced, PTFE-based composites. This unique composition enables a stable, lower dielectric constant by reducing the number of fiberglass plies and increasing the PTFE content. As a result, it supports wider line widths, reducing insertion loss.


Now, let's dive into the data sheet to explore the properties of DiClad 870.


Typical Properties of DiClad 870

DiClad 870 exhibits excellent electrical properties. It has a dielectric constant of 2.33 at both 1 MHz and 10 GHz, with a low dissipation factor of 0.0009 at 1 MHz and 0.0013 at 10 GHz.


The thermal coefficient of dielectric constant ranges from -161 ppm/°C to -10°C to +140°C.


DiClad 870 boasts a high volume resistivity of 1.5 x 10^9 MΩ-cm and a surface resistivity of 3.4 x 10^7 MΩ.


Moreover, it demonstrates an impressive arc resistance of over 180 seconds, tested according to ASTM D-495 using the D48/50 method. Similarly, the dielectric breakdown voltage exceeds 45 kV, tested according to ASTM D-149 using the D48/50 method.


In terms of mechanical properties, DiClad 870 exhibits a peel strength of 14 lbs. per inch after thermal stress. It also shows excellent tensile modulus, tensile strength, compressive modulus, and flexural modulus at 23°C.


When it comes to thermal properties, DiClad 870 offers a low coefficient of thermal expansion of 17 ppm/°C (X axis), 29 ppm/°C (Y axis), and 217 ppm/°C (Z axis) within the temperature range of 0°C to 100°C. However, its thermal conductivity is only 0.257 W/mK at 100°C.


PropertyDiClad 870ConditionTest Method
Electrical Properties
Dielectric Constant @ 10 GHz2.33C23/50IPC TM-650 2.5.5.5
Dielectric Constant @ 1 MHz2.33C23/50IPC TM-650 2.5.5.3
Dissipation Factor @ 10 GHz0.0013C23/50IPC TM-650 2.5.5.5
Dissipation Factor @ 1 MHz0.0009C23/50IPC TM-650 2.5.5.3
Thermal Coefficient of Er (ppm/°C)-161-10°C to +140°CIPC TM-650 2.5.5.5
Adapted
Volume Resistivity (MΩ-cm)1.5 x 10 9C96/35/90IPC TM-650 2.5.17.1
Surface Resistivity (MΩ)3.4 x 10 7C96/35/90IPC TM-650 2.5.17.1
Arc Resistance>180D48/50ASTM D-495
Dielectric Breakdown (kV)>45D48/50ASTM D-149
Mechanical Properties
Peel Strength (lbs.per inch)14After Thermal StressIPC TM-650 2.4.8
Tensile Modulus (kpsi)485(MD), 346(CD)A, 23°CASTM D-638
Tensile Strength (kpsi)14.9(MD), 11.2 (CD)A, 23°CASTM D-882
Compressive Modulus (kpsi)327A, 23°CASTM D-695
Flexural Modulus (kpsi)437A, 23°CASTM D-790
Thermal Properties
Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis17 29 2170°C to 100°CIPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer
Thermal Conductivity (W/mK)0.257100°CASTM E-1225
Flammability ULMeets requirements of UL94-V0C48/23/50, E24/125UL 94 Vertical Burn IPC TM-650 2.3.10
Physical Properties
Density (g/cm3)2.26A, 23°CASTM D-792 Method A
Water Absorption (%)0.02E1/105 + D24/23MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±)0.02 0.00 0.01 NO125°C, ≤ 10-6 torrNASA SP-R-0022A Maximum 1.00% Maximum 0.10%

DiClad 870 meets the UL94-V0 flammability rating, ensuring its safety.


Let's now explore the physical properties of DiClad 870.


It has a density of 2.26 g/cm3 at 23°C, indicating its dense and sturdy nature.


With a water absorption rate of 0.02%, DiClad 870 demonstrates low water absorption.


Lastly, let's look at the outgassing characteristics.


Outgassing refers to the release of volatile materials during use. DiClad 870 shows minimal outgassing with a total mass loss of 0.02%, collected volatile condensable material of 0.00%, and water vapor regain of 0.01% at 125°C and ≤ 10^-6 torr, with no visible condensate.



Our PCB Capability (DiClad 870)

We offer a range of options for DiClad 870 PCBs, including single-sided, double-sided, multi-layer, and hybrid types.


The available thicknesses for DiClad 870 PCBs are 31 mils, 93 mils, and 125 mils.


You can choose between 1oz and 2oz finished copper on the track lines.


The maximum size for a DiClad 870 PCB is 400mm by 500mm, and it can be a single board or a panel with different designs.


We offer solder mask colors such as green, black, blue, red, and yellow.


For pad surface finishes, we provide options like immersion gold, HASL, immersion silver, immersion tin, OSP, ENEPIG, pure gold, and bare copper.


PCB material:Woven Fiberglass reinforced PTFE Laminates
Designation:DiClad 870
Dielectric constant:2.3
Layer count:Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness:31mil (0.787mm), 93mil (2.286mm), 125mil (3.175mm)
Copper weight:1oz (35µm), 2oz (70µm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Red, Yellow etc.
Surface finish:Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Pure gold, Bare copper, etc..

This type of PCB is commonly used in applications such as radar feed networks, commercial phased array networks, low-loss base station antennas, and RF components like filters and couplers.


DiClad 870 materials are compatible with conventional electroless copper and direct deposit metallization processes, enabling the use of standard equipment and chemical processes for plating, imaging, and etching circuit patterns on the material.

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