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High-Performance Solder Paste Machine for Industrial 4.0 MES System

Categories Solder Paste Machine
Brand Name: GKG
Model Number: G9+
Certification: CE,TUV,ROHS
Place of Origin: China
MOQ: 1 set
Price: Negotiation
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 100 sets per month
Delivery Time: 7-15days
Packaging Details: Wooden Package
Product name: High-end Solder paste printing machine
Other name: Automatic Screen Printing Machine
PCB size: 50x50~450x340mm
Transport height: 900±40mm
Air pressure: 4-6kgf/cm³
PCB thickness: 0.4-6mm
Max board weight: 5kg
Machine weight: 1000kg
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High-Performance Solder Paste Machine for Industrial 4.0 MES System

High-Performance Solder Paste Machine for Industrial 4.0 MES System


Introduction


The G9+fully automatic solder paste printing machine is a high-end machine for SMT high-end applications, which can meet the printing process requirements of 03015, 0.25 spacing, high precision, and high speed.


Specification


ModelG9+
Max PCB Size450x340mm
Min PCB size50x50mm
PCB thickness0.4-6mm
Max board weight5kg
Transport height900±40mm
Board edge gap2.5mm
Board height15mm
Transport directionL-R,R-L
Transport speedmax 1500mm/s, program control
Transport methodOne stage
WIdth adjustmentautomatic
I/O interfaceSMEMA
PCB positioning (support method)Magnetic pin/support block/manual up-down table
PCB clamping system
Patented over the top clamping
Side clamping
Adsorption function
Print snap-off
0-20mm
Print mode
one/twice
Print Speed
10-200mm/sec
Print Mode
One /Twice
Squeegee Type
Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
Print pressure0.5-10kg
Template fram size470*370mm~737*737mm(20-40thickness)
Cleaning System
Droops of rain type cleaning system
Reinforced vacuum absorption
Dry, wet vacuum three modes
Back and forth cleaning
CCD FOV
10x8mm
Fiducial mark typesStandard Fiducial mark shape
Pad
Hole
Camera systemLook up/down optics structure
CCD digital camera
Geometry pattern match

Machine Performance


ModelG9+
Repeat position accuracy±12.5um@6,CPK≥2.0
Print accuracy±18um@6,CPK≥2.0
Print cycle time<7.5 sec
Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision

Whole Machine Specification


Power supply
AC:220±10%,50/60HZ, 3.0KW
Air pressure
4~6 kgf/cm²
Air consumption
around 5L/min
Operating temperature
-20℃~+45℃
Operating humidity
30%~60%

Machine Dimensions(without tower light)

1172(L) x 1385(W) x 1530 (H)mm
Machine Weight
Approx: around 1000Kg

Features


1. CCD digital system, new optical path system, uniform circular light, high brightness of coaxial light source. Using two light source systems, the brightness can be adjusted to an infinite cycle, making it easy to identify different market points (including uneven marking points), such as tin plating, copper plating, silver plating, hot air soldering, FPC, and various types of PCB colors.


2. High precision PCB thickness adjustment, extremely reliable structure, and stable XY motion. Manual adjustment can easily adapt to different PCB thicknesses.


3. Guide rail positioning system, new pattern guide rail board detachable, programmable flexible side clamp, specially designed for FPC and PCB warping, executing a unique clamping device. Through software programming, unaffected PCB picking can be automatically stretched and retracted.


4. The new and innovative scraper structure design adopts a comprehensive scraper system, which improves the stability and service life of the scraper.

5, High speed stencil cleaning, downward dispensing cleaning structure successfully prevents clogged opening(which is always the root cause for ineffective cleaning) from taking place. The length of solvent dispensedcan also be easilyamended with software control.
6, New multi-function interface, simplicity , clearly understand, friendly user. Actual temperature and humidity monitor function.

About Packaging

Quality High-Performance Solder Paste Machine for Industrial 4.0 MES System for sale
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