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TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001

Categories Amplifier IC Chips
Brand Name: Texas Instruments
Model Number: TLV314QDBVRQ1
Certification: /
Place of Origin: N/S
MOQ: 1PCS
Price: Negotiation
Payment Terms: T/T
Supply Ability: 9999999+PCS
Delivery Time: 2-7 work days
D/c: Newest
Operating temperature: -40C to 85C
Mounting type: Through Hole
Part number: TDA2030
Shipment: express
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TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001

Amplifier IC Chips Texas Instruments/TI TLV314QDBVRQ1

ECAD ModulePCB Symbol,Footprint & 3D Model
Supply and Demand StatusBalance
PopularityHigh
Fake Threat In the Open Market45 pct.
Quantity per package3000
HTSUS8542.33.0001
ECCNEAR99
REACH StatusREACH Unaffected
MSL Level2 (1 Year)
Case / PackageSOT-23-5
PackageSC-74A, SOT-753
MountingSurface Mount
Operating Temperature Range-40°C ~ 125°C
PackageReel - TR
SeriesAutomotive, AEC-Q100
ManufacturerTexas Instruments
Family NameTLV314
Estimated Pruduction Lead Time34 Weeks
CategoriesIntegrated Circuits (ICs)
Other Part Number-296-45322-1-ND, 296-45322-6, TLV314QDBVRQ1-ND, 296-45322-1, 296-45322-2
FeaturesCMOS Amplifier Circuit Rail-to-Rail SOT-23-5

Features for the TLV314-Q1

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C AmbientOperating Temperature Range
    • Device HBM ESD Classification Level 3A
    • Device CDM ESD Classification LevelC6
  • Low Offset Voltage: 0.75 mV (Typical)
  • Low Input Bias Current: 1 pA (Typical)
  • Wide Supply Range: 1.8 V to 5.5 V
  • Rail-to-Rail Input and Output
  • Gain Bandwidth: 3 MHz
  • Low IQ: 250 µA/Ch (Maximum)
  • Low Noise: 16 nV/√Hz at 1 kHz
  • Internal RF and EMI Filter
  • Number of Channels:
    • TLV314-Q1: 1
    • TLV2314-Q1: 2
    • TLV4314-Q1: 4
  • Extended Temperature Range:
    –40°C to +125°C

Description for the TLV314-Q1

The TLVx314-Q1 family of single-, dual-, and quad-channel operational amplifiersrepresents a new generation of low-power, general-purpose operational amplifiers. Rail-to-railinput and output swings (RRIO), low quiescent current (150 µA typically at 5 V) combine with a widebandwidth of 3 MHz to make this family very attractive for a variety of battery-poweredapplications that require a good balance between cost and performance. The TLVx314-Q1 familyachieves a low-input bias current of 1 pA, making it an excellent choice for high impedancesensors.

The robust design of the TLVx314-Q1 devices provides ease-of-use to the circuit designer:unity-gain stability, RRIO, capacitive loads of up to 300-pF, an integrated RF and EMI rejectionfilter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD)protection (4-kV HBM).

These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to+125°C.

The TLV314-Q1 (single) is available in both 5-pin SC70 and SOT-23 packages. TheTLV2314-Q1 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314-Q1 isoffered in a 14-pin TSSOP package.

Quality TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001 for sale
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