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| Categories | Tungsten Products |
|---|---|
| Model Number: | Tungsten Ring |
| MOQ: | Negotiate |
| Price: | Negitionable |
| Payment Terms: | L/C, D/A, D/P, T/T |
| Supply Ability: | 10000sets/month |
| Delivery Time: | 30 days after receiving down payment |
| Packaging Details: | Standard export cartons |
| Name: | Tungsten Ring |
| Molecular Weight: | 183.85 |
| Melting Point: | 3410 °C |
| Density: | 19.3 g/cm3 |
| Application: | semiconductor, chemical vapor deposition (CVD) |
| Tensile Strength: | 750 MPa |
| Company Info. |
| Luoyang Hypersolid Metal Tech Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
99.95% Pure Tungsten Products Tungsten Ring For Semiconductor
Introduction
Grade: W 1
Purity: > 99.95%
Density: 17.1 g / cm 3-19.3 g / cm 3
Size: Diameter > 10 mm * thick > 0.1 mm
Processing technique: cold rolled/machined
Surface: polished surface /machined surface
Color: metal color
Condition: vacuum annealing
Melting point: 3410 degree
Boiling point: 5927 degree
Delivery time: 3-10 days
Parameter
Molecular Weight | 183.85 |
|---|---|
Appearance | Silvery |
Melting Point | 3410 °C |
Boiling Point | 5900 °C |
Density | 19.3 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 5.65 μΩ ·m (27 °C) |
Electronegativity | 1.7 Paulings |
Heat of Fusion | 35.3 kJ/mol |
Heat of Vaporization | 806.7 kJ/mol |
Poisson's Ratio | 0.28 |
Specific Heat | 0.133 J/g mol (20 °C) |
Tensile Strength | 750 MPa |
Thermal Conductivity | 1.73 W/m K |
Thermal Expansion | (25 °C) 4.5 µm·m-1·K-1 |
Vickers Hardness | 3430 MPa |
Young's Modulus | 411 GPa |
Tungsten Ring Applications
1. widely used in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications;
2. applied in producing electrodes, heating elements, heat shields, sintering trays, sintering boats, stacking sheets, base plates, sputtering targets, crucibles in electronic and vacuum applications.
3. can be used as contacts in vehicle motors.
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