Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity

Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force

Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Purchase information:

Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certifications, with all products going through UL, SGS, RoHS certification.

AOK designs, develops and manufactures Thermal Interface Materials for industry leaders around the globe. Our core capabilities allow AOK to provide customers with customized solutions to meet their specific application needs.

Aochuan was founded in 2004. After 18 years, we have set up world class R&D system that made Aochuan leader of Thermal Interface Materials Industry in China.

Global Sales offices in Shenzhen, Heyuan, Taiwan, Toronto Canada North America, Europe
GMP 100,000 class Clean Workshop. over 12,000 m² independent park, 7 automated production lines, more than 5,000 tons annual production capacity

Long term partner : JLR, Commscope, OSRAM, BYD, ZTE, Hikvision, TP-LINK, Dahua, Delta, Foxconn ect.