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Categories | Electronic Components IC Chips |
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Brand Name: | ADI / MAXIM |
Model Number: | ADG772BCPZ-REEL7 |
Place of Origin: | original |
MOQ: | 1 |
Price: | Negotiable |
Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Supply Ability: | 999999 |
Delivery Time: | 1-3 days |
Packaging Details: | standard |
Multiplexer/Demultiplexer Circuit: | 2:1 |
On-State Resistance (Max): | 6.7Ohm (Typ) |
Channel-to-Channel Matching (ΔRon): | 40mOhm |
Voltage - Supply, Single (V+): | 2.7V ~ 3.6V |
Voltage - Supply, Dual (V±): | - |
Switch Time (Ton, Toff) (Max): | 12.5ns, 9.5ns |
ADG772BCPZ-REEL7 Electronic Components IC Chip CMOS Low Power Dual 2:1 Mux Demux Package 10-LFCSP-UQ
Product Status | Active | |
Switch Circuit | SPDT | |
Multiplexer/Demultiplexer Circuit | 2:1 | |
Number of Circuits | 2 | |
On-State Resistance (Max) | 6.7Ohm (Typ) | |
Channel-to-Channel Matching (ΔRon) | 40mOhm | |
Voltage - Supply, Single (V+) | 2.7V ~ 3.6V | |
Voltage - Supply, Dual (V±) | - | |
Switch Time (Ton, Toff) (Max) | 12.5ns, 9.5ns | |
-3db Bandwidth | 630MHz | |
Charge Injection | 0.5pC | |
Channel Capacitance (CS(off), CD(off)) | 2.4pF, 6.9pF | |
Current - Leakage (IS(off)) (Max) | 200pA | |
Crosstalk | -90dB @ 1MHz | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Mounting Type | Surface Mount | |
Package / Case | 10-UFQFN, CSP | |
Supplier Device Package | 10-LFCSP-UQ (1.6x1.3) |
FEATURES
USB 2.0 (480 Mbps) and USB 1.1 (12 Mbps) signal
switching compliant
Tiny 10-lead 1.3 mm × 1.6 mm mini LFCSP package
and 12-lead 3 mm × 3 mm LFCSP package
2.7 V to 3.6 V single-supply operation
Typical power consumption: <0.1 μW
RoHS compliant
APPLICATIONS
USB 2.0 signal switching circuits
Cellular phones
PDAs
MP3 players
Battery-powered systems
Headphone switching
Audio and video signal routing
Communications systems
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