Low Porosity Copper Tungsten Alloy , 65W35Cu Grade WCu Heat Sink

WCu Copper Tungsten AlloyTungsten Copper Heat Sink with 35 wt.% Cu

Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Description:

Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.

Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.

The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.

Advantages:

1. Excellent flatness, surface finish, and size control

2. Semi-finished or finished (Ni/Au plated) products available

3. Low porosity

Product Properties:

Zhuzhou Teyou New Material Co.,Ltd owned lots of elites specialize in refractory metal industry and precision machining industry as a pioneering enterprise focus on technology innovation,who stepping up efforts to serve for emerging industries of strategic importance and providing full set design solution required by global customers. Including machinery and mechanical design , material selection, production plant layout, the installation and transportation of equipments ,etc. We have already been desgined plenty of sets of hot zone and high-termerature sintering equipments successfully.