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Cu - W Semiconductor Substrate

Categories Heat Sink
Brand Name: JBNR
Model Number: 50WCu,75WCu,80WCu,85WCu,90WCu
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: tungsten copper
Density: 12.2
CTE: 12.5
TC: 310-340
Application: integrated circuit
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Cu - W Semiconductor Substrate


Cu-W semiconductor substrate tungsten copper heat sink package material for integrated circuit

Description:


CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.

Advantages:

High thermal conductivity

Excellent hermeticity

Excellent flatness, surface finish, and size control

Semi-finished or finished (Ni/Au plated) products available


Product Properties:

GradeW ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu90±2%17.06.5180 (25℃) /176 (100℃)
85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
50WCu50±2%12.212.5340 (25℃) / 310 (100℃)



Application:

Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

Product picture:

Quality Cu - W Semiconductor Substrate for sale
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