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Categories | Heat Sink |
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Brand Name: | JBNR |
Model Number: | 50WCu,75WCu,80WCu,85WCu,90WCu |
Place of Origin: | CHINA |
MOQ: | Negotiation |
Price: | Negotiable |
Payment Terms: | L/C, , T/T, Western Union |
Delivery Time: | 15days |
Packaging Details: | as customer required |
Material: | tungsten copper |
Density: | 12.2 |
CTE: | 12.5 |
TC: | 310-340 |
Application: | integrated circuit |
Cu-W semiconductor substrate tungsten copper heat sink package
material for integrated circuit
Description:
CuW heat sink material is a composite of tungsten and copper, with
both tungsten low expansion characteristics, but also has copper of
high thermal conductivity properties, and the tungsten and copper
in the thermal expansion coefficient and thermal conductivity can
be adjusted with the W-Cu composition, also the composite can be
machined to various shape.
Advantages:
High thermal conductivity
Excellent hermeticity
Excellent flatness, surface finish, and size control
Semi-finished or finished (Ni/Au plated) products available
Product Properties:
Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
Our products are widely used in applications such as heat sink,
heat spreader, shim, laser diode submount, substrates, base plate,
flange, chip carrier, optical bench, etc.
Product picture:
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