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High Frequency Mosfet Power Transistor 12N10 N Channel Low Gate Charge

Categories Mosfet Power Transistor
Brand Name: Hua Xuan Yang
Model Number: 12N10
Certification: RoHS、SGS
Place of Origin: ShenZhen China
MOQ: 1000-2000 PCS
Price: Negotiated
Payment Terms: L/C T/T Western Union
Supply Ability: 18,000,000PCS / Per Day
Delivery Time: 1 - 2 Weeks
Packaging Details: Boxed
Product name: Mosfet Power Transistor
APPLICATION: Power Management
FEATURE: Excellent RDS(on)
Power mosfet transistor: Enhancement Mode Power MOSFET
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High Frequency Mosfet Power Transistor 12N10 N Channel Low Gate Charge

HXY12N10 N-Channel Enhancement Mode Power MOSFET


DESCRIPTION

The HXY12N10 uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. It can be used in a wide variety of applications.


FEATURES

● VDS =100V,ID =12A

RDS(ON) < 130mΩ @ VGS =10V


Application


● Power switching application

● Hard switched and high frequency circuits

● Uninterruptible power supply



ORDERING INFORMATION

ParameterSymbolLimitUnit
Drain-Source VoltageVDS100V
Gate-Source VoltageVGS±20V
Drain Current-ContinuousID12A
Drain Current-Continuous(TC=100℃)ID (100℃)6.5A
Pulsed Drain CurrentIDM38.4A
Maximum Power DissipationPD30W
Derating factor0.2W/℃
Single pulse avalanche energy (Note 5)EAS20mJ
Operating Junction and Storage Temperature RangeTJ,TSTG-55 To 175

Note: Pin Assignment: G: Gate D: Drain S: Source



ABSOLUTE MAXIMUM RATINGS (TC = 25°С, unless otherwise specified)

PARAMETERSYMBOLRATINGSUNIT
Drain-Source VoltageVDSS600V
Gate-Source VoltageVGSS±30V
Continuous Drain CurrentID10A
Pulsed Drain Current (Note 2)IDM40A
Avalanche Current (Note 2)IAR8.0A
Avalanche EnergySingle Pulsed (Note 3)EAS365mJ
Peak Diode Recovery dv/dt (Note 4)dv/dt4.5ns

Power Dissipation

TO-220

PD

156W
TO-220F150W
TO-220F252W
Junction TemperatureTJ+150°C
Storage TemperatureTSTG-55 ~ +150°C

Notes: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.

Absolute maximum ratings are stress ratings only and functional device operation is not implied.

4. Repetitive Rating: Pulse width limited by maximum junction temperature.

5. L = 84mH, IAS =1.4A, VDD = 50V, RG = 25 Ω Starting TJ = 25°C

6. ISD ≤ 2.0A, di/dt ≤200A/μs, VDD ≤BVDSS, Starting TJ = 25°C


ELECTRICAL CHARACTERISTICS (TJ = 25°С, unless otherwise specified)


ParameterSymbolConditionMinTypMaxUnit
Off Characteristics
Drain-Source Breakdown VoltageBVDSSVGS=0V ID=250μA100110-V
Zero Gate Voltage Drain CurrentIDSSVDS=100V,VGS=0V--1μA
Gate-Body Leakage CurrentIGSSVGS=±20V,VDS=0V--±100nA
On Characteristics (Note 3)
Gate Threshold VoltageVGS(th)VDS=VGS,ID=250μA1.21.82.5V
Drain-Source On-State ResistanceRDS(ON)VGS=10V, ID =8A98130m Ω
Forward TransconductancegFSVDS=25V,ID=6A3.5--S
Dynamic Characteristics (Note4)
Input CapacitanceClss

VDS=25V,VGS=0V, F=1.0MHz

-690-PF
Output CapacitanceCoss-120-PF
Reverse Transfer CapacitanceCrss-90-PF
Switching Characteristics (Note 4)
Turn-on Delay Timetd(on)

VDD=30V,ID=2A,RL=15Ω VGS=10V,RG=2.5Ω

-11-nS
Turn-on Rise Timetr-7.4-nS
Turn-Off Delay Timetd(off)-35-nS
Turn-Off Fall Timetf-9.1-nS
Total Gate ChargeQg

VDS=30V,ID=3A, VGS=10V

-15.5nC
Gate-Source ChargeQgs-3.2-nC
Gate-Drain ChargeQgd-4.7-nC
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)VSDVGS=0V,IS=9.6A--1.2V
Diode Forward Current (Note 2)IS--9.6A
Reverse Recovery Timetrr

TJ = 25°C, IF =9.6A

di/dt = 100A/μs(Note3)

-21nS
Reverse Recovery ChargeQrr-97nC
Forward Turn-On TimetonIntrinsic turn-on time is negligible (turn-on is dominated by LS+LD)


Essentially independent of operating temperature.Notes: 1. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%.



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