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5G Communication PCB And PCBA Asic Miner Circuit Board Smart Watch From Circuit Board Fact

5G promote high growth in PCB demand, and HDI will usher in new development in the future

5G commercial landing promotes high growth of PCB demand, focusing on high-end HDI and packaging substrates in the future

The vigorous development of 5G communication and the high growth of the server industry are driving the demand for communication boards.

According to Prismark statistics, the PCB market size of the downstream communication industry in 2018 was 11.692 billion US dollars, which will reach 13.747 billion US dollars in 2022, and a compound annual growth rate of 6.2% in 2017-2022. We estimate the segmentation of wireless base stations. In 2019, the global PCB market for 5G wireless base station construction will be approximately 13.365 billion yuan, and will reach a peak of 45.163 billion yuan in 2022. The explosive growth of the server market in 2018 has driven demand for high-level boards. In the future, 5G construction will further expand server demand and promote server product upgrades. The server PCB market is expected to continue to expand.

1. Product application

Any layer of interconnect board products can be applied to mobile communication terminals, which integrates a variety of circuits, enabling mobile terminals to handle complex tasks and have rich communication methods. With the development of communication technologies, mobile terminals have become modern Internet services. The main platform.

2 . Specifications:

PCBs for high frequency applications require to be subjected to automatic inspection procedures, both optical (AOI) or performed through ATE. These procedures allow to enormously increase the quality of the product, highlighting possible errors or inefficiencies of the circuit. The recent progress made in the field of automatic inspection and testing of PCBs has led to significant time savings and reduced costs associated with manual verification and testing. The use of new automated inspection techniques will help overcome the challenges imposed by 5G, including global impedance control in high frequency systems. Increased adoption of automated inspection methods also allows for consistent performance with high production rates.

Our PCBs facility is located at East China, closed to Shanghai City.

We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.