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| Categories | Industrial PCB Assembly |
|---|---|
| Brand Name: | IBE |
| Model Number: | IBE-133958 |
| Certification: | IATF/TS16949,ISO13485,ISO 9001,ISO14001,UL |
| Place of Origin: | CHINA,VIETNAM,USA |
| MOQ: | no MOQ |
| Price: | Negotiable |
| Payment Terms: | L/C, T/T |
| Supply Ability: | 20000pcs+unit+month |
| Delivery Time: | 5-10 weeks depends on components lead time |
| Packaging Details: | ESD bag+card carton(custom made) |
| Material: | FR4, FR4 CEM1 CEM3 Hight TG |
| Layers: | 1-24layers, 1-28 L |
| Copper thickness: | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz |
| Surface finishing: | HASL, ENIG, OSP, Immersion gold, HASL Lead Free |
| Type: | Electronic Board, PCBA Design service |
| Company Info. |
| IBE ELectronics Co.,LTD |
| View Contact Details |
| Product List |
PCBA design, PCB production,PCB, PCBA, EMS, OEM, ODM manufacturer
IBE is a full-service EMS (Electronic Manufacturing Service)
contract manufacturer based in China that provides small to medium
volume PCB fabrication and EMS.
Established in 2005, IBE have three manufacturing locations in
China,US,Vietnam . In our PCB facility, we produce simple to
complex products from 1 to 40 layers. In our EMS facility, we can
do conventional thru-hole assembly, SMT assembly including BGA
assembly, turnkey box build, supply chain management, project
management, new product introduction, testing and product
development.
Our Advantages:
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test |
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |
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