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| Categories | Alu PCB |
|---|---|
| Brand Name: | IBE |
| Model Number: | Alu PCB |
| Certification: | ISO/TS16949 ISO13485 |
| Place of Origin: | China |
| MOQ: | 100 |
| Price: | $0.1-$0.5 |
| Payment Terms: | D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability: | 50000pcs/week |
| Delivery Time: | 5-7working days |
| Packaging Details: | ESD bag |
| Min. line width: | 0.075mm/0.075mm(3mil/3mil) |
| Surface finishing: | HASL |
| Copper thickness: | 1.5oz |
| Base material: | FR4 |
| Min. line spacing: | 0.075mm |
| Board thickness: | 1.6mm |
| Min. hole size: | 0.25mm |
| soldermask color: | white |
| silkscreen color: | black |
| layer: | 1-32L |
| Company Info. |
| IBE ELectronics Co.,LTD |
| View Contact Details |
| Product List |
IBE provides better, faster and more cost-effective solutions to our customers' most challenging design for excellence (DFx) problems. From manufacturing to testing to supply chain, IBE provides customized design support to our OEM partners, enabling them to establish a strong competitive position within their marketplace.
We have a proven record of guiding manufacturers throughout the entire electronics manufacturing process. From simple designs to complex system integration, IBE provides the end-to-end electronics manufacturing services necessary to compete in a global marketplace.
Our Advantages:
1, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam.
2, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test
3, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
4, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
PCBA Capability
| PCB Assembly Capability | |
| Stencil size range: | 1560*450mm |
| Min SMT package: | 0402/1005(1.0x0.5mm) |
| Min IC pitch: | 0.3mm |
| Max PCB Size: | 1200*400mm |
| Min PCB thickness: | 0.35mm |
| Min Chip Size: | 01005 |
| Max BGA Size: | 74*74mm |
| BGA Ball Pitch: | 1.00~3.00mm |
| BGA Ball Diameter: | 0.4~1.0mm |
| QFP Lead Pitch: | 0.38~2.54mm |
| Testing : | ICT,AOI,X-RAY,Funtional test etc. |
Order Conditions | Standard Delivery Date | The fastest Delivery Date |
Prototype ( <20pcs) | 2days | 8hours |
Small Volume (20-100pcs) | 6days | 12hours |
Medium Volume (100-1000) | 3days | 24hours |
Mass Production (>1000) | Depends on BOM | Depends on BOM |
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